Siemens' Acquisition of UltraSoC Shakes Up EDA / SIP Markets
July 27, 2020
On June 23rd, 2020, Siemens AG signed a letter of intent to acquire Cambridge, UK-based 3rd Party Semiconductor Intellectual Property (SIP) vendor, UltraSoC. Terms of the transaction were not disclosed except to say Siemens plans to integrate UltraSoC’s technology into the Xcelerator portfolio as part of Mentor’s Tessent™ software product suite. The acquisition is expected to close in Siemens 4th fiscal quarter this year.
There are several areas where this acquisition is impactful to the SIP market, the EDA market and the broader semiconductor market.
To read the full article, click here
Related Semiconductor IP
Related Blogs
- DAC 2024 - Showcasing the future of RISC-V through EDA
- UALink™ Shakes up the Scale-up AI Compute Landscape
- A fight for position shakes up the specialty foundry business
- Microsoft shakes up server market with news it plans to run with ARM
Latest Blogs
- FiRa 3.0 Use Cases: Expanding the Future of UWB Technology
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits