CEVA's TeakLite-4: Audio Once Again Comes to the Fore
"If it's not broken, don't fix it." That well-known maxim seemed for many years to encapsulate CEVA's approach to audio DSP cores, given that the company's third-generation offering in this particular application space (and first-generation 32-bit core), the TeakLite-III, dates from 2007. However, after both fortifying its foundation communications DSP offerings and moving into the emerging embedded vision space earlier this year, the company has now turned its attention back to its other bread-and-butter money-maker, audio, with the newly introduced TeakLite-4 family.
To read the full article, click here
Related Semiconductor IP
- Special Purpose Low (Statistical) offset Operation Amplifier
- Rail to Rail Input and Output Operational Amplifier
- Special Purpose Low offset Operational Amplifier
- Special Purpose Low offset Operational Amplifier
- High Current, Low offset fast Operation Amplifier
Related Blogs
- LE Audio and Auracast Aim to Personalize the Audio Experience
- What is Spatial Audio and What Does it Have To Do With Binaural Audio?
- Evaluating Spatial Audio - Part 3 - Creating a repeatable system to evaluate spatial audio
- Ultra Wideband Radar To Drive Digital Key for Safety, Security and Beyond
Latest Blogs
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Empowering your Embedded AI with 22FDX+