欧盟推进《芯片法案》
By David Manners, Electronics Weekly (November 24, 2022)
Yesterday the EU moved a step closer to securing its own Chips Act when member states agreed to a $46.6 billion proposal to subsidise chip production in Europe.
The next stage is to get EU ministers to agree the plan when they meet on December 1st.
After that, the European Parliament will hold a debate on the plan in the New Year.
The plan is unfunded with the EC agreeing to put up less than 15% of the cost with Member States liable for the rest.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- 观点评论 : 美国“芯片法案”出台加剧长期存在的美中科技竞争局势
- 专注于信号转换芯片的法国SCALINX半导体无晶圆厂获得1050万欧元战略投资
- Dolphin Integration 180纳米标准单元库帮助RFID芯片大幅提高功耗和密度性能
- Cadence通过ARM从芯片到板到系统的优化解决方案实现客户创新