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The DDR multiPHYs are mixed-signal PHY IP cores that supply the complete physical interface to JEDEC standard DDR2 DDR3 LPDDR2 LPDDR3 SDRAM memories up 1066 Mbps data rates and Mobile (also referred as mDDR LPDDR) 400 rates. This particular supports switching between once a chip is in production. “Lite” does not go full 1600 rate targeted for DDR3. Instead this an area feature optimized DDR2/DDR3 customers want market with interfaces also insurance policy against equivalent devices becoming cheaper while their remains market. As part of optimization small number new features such write leveling supported they by SDRAMs. \r\n
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\tFull documentation including implementation guide\r\n
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"text_high_priority" => "YouDDR High Speed DDR Interface Solution Brite Semiconductor"
"text_low_priority" => """
Brite provides a complete DDR subsystem including not only controller PHY and IO but also corresponding tuning configuration software. And this solution can support LPDDR2 DDR3 LPDDR3 DDR4 LPDDR4/4x combo with the data rate from 667Mbps to 4266Mbps. YouPHY-DDR delivers combination of high speed low power performance. With dynamic self-calibrating logic (DSCL) adaptive bit calibration (DABC) technology YouDDR automatically compensate chip/package/board/memory PVT variation bit-bit skew. higher performance smaller area shorter time-to-market. Controller\r\n
\r\n
\r\n
\tHighly flexible customizable DFI 4.0 compliant architecture\r\n
\tSupports up 32 target interfaces AXI AHB FIFO-based interfaces\r\n
\tUser-customizable arbiter (scheduler)\r\n
\r\n
\r\n
DDR PHY\r\n
\r\n
\r\n
\tSupports multi-rank DRAM compensation\r\n
\tComprehensive protocol training\r\n
\t\r\n
\t\tCA training\r\n
\t\tDQ read write training\r\n
\t\tWrite leveling\r\n
\t\tVref training\r\n
\t\r\n
\t\r\n
\tPHY is compatible backwards-compatible earlier standards for simplified integration existing\r\n
\t\r\n
\t\tDFI-compliant Controllers\r\n
\t\r\n
\t\r\n
\tPHY includes DSCL technology\r\n
\t\r\n
\t\tAutomatically compensates interface timing due static (process-related) variations operating temperature voltage patterns\r\n
\t\r\n
\t\r\n
\tPHY DABC skew within each byte lane\r\n
\t\r\n
\t\r\n
\tDSCL lowest latency 0.5 – 1 clock cycles\r\n
\tFast simple system bring-up via hardware routine\r\n
\tATC(Auto Tracking Compensation) technology\r\n
\t\r\n
\t\tDLL's ATC\r\n
\t\tRound-Trip's ATC\r\n
\t\tRead-DQ-Eye's ATC\r\n
\t\r\n
\t\r\n
\tImproved long term reliability\r\n
\tFlexible rectilinear layout offers industry’s smallest hardened match pad frame\r\n
\tPHY (and optionally IO) configured as drop-in hard macro easy implementation\r\n
\tCombo options include:\r\n
\t\r\n
\t\tDDR2/DDR3 Combo\r\n
\t\tLPDDR2/DDR3 Combo\r\n
\t\tLPDDR2/LPDDR3/DDR3 Combo\r\n
\t\tDDR3/DDR4 Combo\r\n
\t\tLPDDR34/DDR34 Combo \r\n
\t\tLPDDR3/4 + Combo\r\n
\t\tLPDDR34(x)/DDR4 Combo\r\n
\t\tDDR4 PHY\r\n
\t\r\n
\t\r\n
\r\n
\r\n
DDR I/O\r\n
\r\n
\r\n
\tHigh jitter IO\r\n
\tLow / small footprint\r\n
\tSilicon proven\r\n
"""
"text_medium_priority" => "DDR3 PHY DDR4 LPDDR3 LPDDR4 28nm HK"
"updated_at" => 1759151635
]
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<ul>\r\n
\t<li>Compliant to JEDEC DDR5 SDRAM Specification, Data Buffer & RCD Specification.</li>\r\n
\t<li>Supports connection to any DDR5 Memory Controller IP communicating with a JEDEC compliant DDR5 Memory Model.</li>\r\n
\t<li>Supports configurable SDRAM addressing of different sizes (x4, x8 and x16).</li>\r\n
\t<li>Available in all memory sizes up to 64 Gb.</li>\r\n
\t<li>Supports for all speed-grades/speed-bins.</li>\r\n
\t<li>Supports configurable timing parameters and rank associations.</li>\r\n
\t<li>Supports 3DS with command to command timings checks in SLR & DLR.</li>\r\n
\t<li>Supports all Command Address Rates (SDR1, SDR2 & DDR).</li>\r\n
\t<li>Supports BCOM Training Mode, Strobe & Data Trainings, DCATM, DCSTM, QCATM, QCSTM & Enhanced DCATM. AXI In AXI Seq AXI Master APB/AHB seq APB/AHB Master APB/AHB In DFI In Memory Controller BFM/DUT DFI-PHY BFM/DUT DDR In DFI Monitor Functional Coverage Asser ons Transac on Logger APB Master APB Seq DFI Monitor Functional Coverage Asser ons Transac on Logger Memory BFM/DUT I2C SPD TS PMIC DIMMs</li>\r\n
\t<li>Supports CA parity for command/address bus.</li>\r\n
\t<li>Supports Control Word decoding, write & read.</li>\r\n
\t<li>Supports Data Masking (DM).</li>\r\n
\t<li>Supports Cyclic Redundancy Check (CRC).</li>\r\n
\t<li>Supports Programmable burst lengths.</li>\r\n
\t<li>Supports capturing all the valid DDR5 commands including Activate, Read Write, Precharge.</li>\r\n
\t<li>Supports Power-up Reset and initialization sequences.</li>\r\n
\t<li>Supports Precharge Power-Down, Active Power-Down, Self-Refresh operation (with and without clock stop).</li>\r\n
\t<li>Reports various timing errors, which can be used to check timing violations.</li>\r\n
\t<li>Provides full control to the user to enable/disable various types of messages.</li>\r\n
\t<li>Support for Multiple Ranks architecture.</li>\r\n
\t<li>Supports advanced System Verilog features like constrained random testing.</li>\r\n
\t<li>Supports dynamically configurable modes.</li>\r\n
\t<li>Strong Protocol Monitor with real time exhaustive programmable checks.</li>\r\n
\t<li>Supports Dynamic as well as Static Error Injection scenarios.</li>\r\n
\t<li>On the fly protocol checking using protocol check functions, static and dynamic assertion.</li>\r\n
\t<li>Built in Coverage analysis.</li>\r\n
\t<li>Provides a comprehensive user API (callbacks) in Monitor, Controller and Memory Model BFMs.</li>\r\n
\t<li>Graphical analyzer to show transactions for easy debugging.</li>\r\n
</ul>
"""
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"overview" => "<p>The DDR5 LRDIMM Verification IP provides an effective & efficient way to verify the components interfacing with DDR5 LRDIMM interface of an ASIC/FPGA or SoC. The DDR5 LRDIMM VIP is fully compliant with Standard DDR5 specification, DDR5 Memory Buffer specification & DDR5 RCD specification from JEDEC. This VIP is a light weight with an easy plug-and-play interface so that there is no hit on the design time and the simulation time.</p>"
"overview_cn" => ""
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<ul>\r\n
\t<li>Compliant to JEDEC DDR5 SDRAM Specification, Data Buffer & RCD Specification.</li>\r\n
\t<li>Supports connection to any DDR5 Memory Controller IP communicating with a JEDEC compliant DDR5 Memory Model.</li>\r\n
\t<li>Supports configurable SDRAM addressing of different sizes (x4, x8 and x16).</li>\r\n
\t<li>Available in all memory sizes up to 64 Gb.</li>\r\n
\t<li>Supports for all speed-grades/speed-bins.</li>\r\n
</ul>
"""
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"text_high_priority" => "DDR5 LRRDIMM Verification IP Truechip Solutions"
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The DDR5 LRDIMM Verification IP provides an effective & efficient way to verify the components interfacing with interface of ASIC/FPGA or SoC. VIP is fully compliant Standard specification Memory Buffer RCD from JEDEC. This a light weight easy plug-and-play so that there no hit on design time and simulation time. \r\n
\tCompliant JEDEC SDRAM Specification Data Specification.\r\n
\tSupports connection any Controller communicating Model.\r\n
\tSupports configurable addressing different sizes (x4 x8 x16).\r\n
\tAvailable in all memory up 64 Gb.\r\n
\tSupports for speed-grades/speed-bins.\r\n
\tSupports timing parameters rank associations.\r\n
\tSupports 3DS command timings checks SLR DLR.\r\n
\tSupports Command Address Rates (SDR1 SDR2 DDR).\r\n
\tSupports BCOM Training Mode Strobe Trainings DCATM DCSTM QCATM QCSTM Enhanced DCATM. AXI In Seq Master APB/AHB seq DFI BFM/DUT DFI-PHY DDR Monitor Functional Coverage Asser ons Transac Logger APB I2C SPD TS PMIC DIMMs\r\n
\tSupports CA parity command/address bus.\r\n
\tSupports Control Word decoding write read.\r\n
\tSupports Masking (DM).\r\n
\tSupports Cyclic Redundancy Check (CRC).\r\n
\tSupports Programmable burst lengths.\r\n
\tSupports capturing valid commands including Activate Read Write Precharge.\r\n
\tSupports Power-up Reset initialization sequences.\r\n
\tSupports Precharge Power-Down Active Self-Refresh operation (with without clock stop).\r\n
\tReports various errors which can be used check violations.\r\n
\tProvides full control user enable/disable types messages.\r\n
\tSupport Multiple Ranks architecture.\r\n
\tSupports advanced System Verilog features like constrained random testing.\r\n
\tSupports dynamically modes.\r\n
\tStrong Protocol real exhaustive programmable checks.\r\n
\tSupports Dynamic as well Static Error Injection scenarios.\r\n
\tOn fly protocol checking using functions static dynamic assertion.\r\n
\tBuilt Coverage analysis.\r\n
\tProvides comprehensive API (callbacks) Model BFMs.\r\n
\tGraphical analyzer show transactions debugging.\r\n
"""
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<ul>\r\n
\t<li>Compliant to JEDEC DDR5 SDRAM & DDR5 RCD Specification.</li>\r\n
\t<li>Supports connection to any DDR5 Memory Controller IP communicating with a JEDEC compliant DDR5 Memory Model.</li>\r\n
\t<li>Supports configurable SDRAM addressing of different sizes (x4, x8 and x16).</li>\r\n
\t<li>Available in all memory sizes from up to 64 Gb.</li>\r\n
\t<li>Supports all Command Address Rates (SDR1, SDR2 & DDR).</li>\r\n
\t<li>Supports Output Inversion and Mirroring.</li>\r\n
\t<li>Supports training modes: DCSTM, QCSTM, DCATM, EDCATM, QCATM.</li>\r\n
\t<li>Supports Transparent Mode, VHost Mode, CA Validation Pass-Through Mode. AXI Seq AXI Master APB/AHB seq APB/AHB Master APB/AHB In DFI In Memory Controller BFM/DUT DFI Monitor Functional Coverage Asser ons Transac on Logger DDR In DFI-PHY BFM/DUT APB Master APB Seq DFI Monitor Functional Coverage Asser ons Transac on Logger Memory BFM/DUT I2C SPD TS PMIC DIMMs</li>\r\n
\t<li>Supports Control words decode, read, directed and paged access.</li>\r\n
\t<li>Supports 3DS with command to command timings checks in SLR & DLR.</li>\r\n
\t<li>Supports Data Masking (DM).</li>\r\n
\t<li>Supports Cyclic Redundancy Check (CRC).</li>\r\n
\t<li>Support for all speed-grades/speed-bins.</li>\r\n
\t<li>Supports Programmable burst lengths (BC8, BL16, BL32, BL32 OTF).</li>\r\n
\t<li>Supports configurable timing parameters and rank associations.</li>\r\n
\t<li>Supports capturing all the valid DDR5 commands including Activate, Read Write, Precharge.</li>\r\n
\t<li>Supports CA parity for command/address bus.</li>\r\n
\t<li>Supports Power-up Reset and initialization sequences.</li>\r\n
\t<li>Supports Precharge Power-Down, Active Power-Down, Self-Refresh (with and without Clock Stop) operation.</li>\r\n
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\t<li>Supports full timing models or bus functional models.</li>\r\n
\t<li>Support for Multiple Ranks architecture.</li>\r\n
\t<li>Supports advanced System Verilog features like constrained random testing.</li>\r\n
\t<li>Supports dynamically configurable modes.</li>\r\n
\t<li>Strong Protocol Monitor with real time exhaustive programmable checks.</li>\r\n
\t<li>Supports Dynamic as well as Static Error Injection scenarios.</li>\r\n
\t<li>Built in Coverage analysis.</li>\r\n
\t<li>Provides a comprehensive user API (callbacks) in Monitor, Controller and Memory Model BFMs.</li>\r\n
\t<li>Graphical analyzer to show transactions for easy debugging.</li>\r\n
</ul>
"""
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"overview" => "<p>The DDR5 RDIMM Verification IP provides an effective & efficient way to verify the components interfacing with DDR5 RDIMM interface of an ASIC/FPGA or SoC. The DDR5 RDIMM VIP is fully compliant with Standard DDR5 specification from JEDEC. This VIP is a light weight with an easy plug-and-play interface so that there is no hit on the design time and the simulation time.</p>"
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<ul>\r\n
\t<li>The DDR5 RDIMM Verification IP provides an effective & efficient way to verify the components interfacing with DDR5 RDIMM interface of an ASIC/FPGA or SoC.</li>\r\n
\t<li>The DDR5 RDIMM VIP is fully compliant with Standard DDR5 specification from JEDEC.</li>\r\n
\t<li>This VIP is a light weight with an easy plug-and-play interface so that there is no hit on the design time and the simulation time.</li>\r\n
</ul>
"""
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The DDR5 RDIMM Verification IP provides an effective & efficient way to verify the components interfacing with interface of ASIC/FPGA or SoC. VIP is fully compliant Standard specification from JEDEC. This a light weight easy plug-and-play so that there no hit on design time and simulation time. \r\n
\tCompliant JEDEC SDRAM RCD Specification.\r\n
\tSupports connection any Memory Controller communicating Model.\r\n
\tSupports configurable addressing different sizes (x4 x8 x16).\r\n
\tAvailable in all memory up 64 Gb.\r\n
\tSupports Command Address Rates (SDR1 SDR2 DDR).\r\n
\tSupports Output Inversion Mirroring.\r\n
\tSupports training modes: DCSTM QCSTM DCATM EDCATM QCATM.\r\n
\tSupports Transparent Mode VHost CA Validation Pass-Through Mode. AXI Seq Master APB/AHB seq In DFI BFM/DUT Monitor Functional Coverage Asser ons Transac Logger DDR DFI-PHY APB I2C SPD TS PMIC DIMMs\r\n
\tSupports Control words decode read directed paged access.\r\n
\tSupports 3DS command timings checks SLR DLR.\r\n
\tSupports Data Masking (DM).\r\n
\tSupports Cyclic Redundancy Check (CRC).\r\n
\tSupport for speed-grades/speed-bins.\r\n
\tSupports Programmable burst lengths (BC8 BL16 BL32 OTF).\r\n
\tSupports timing parameters rank associations.\r\n
\tSupports capturing valid commands including Activate Read Write Precharge.\r\n
\tSupports parity command/address bus.\r\n
\tSupports Power-up Reset initialization sequences.\r\n
\tSupports Precharge Power-Down Active Self-Refresh (with without Clock Stop) operation.\r\n
\tReports various errors which can be used check violations.\r\n
\tProvides full control user enable/disable types messages.\r\n
\tSupports models bus functional models.\r\n
\tSupport Multiple Ranks architecture.\r\n
\tSupports advanced System Verilog features like constrained random testing.\r\n
\tSupports dynamically modes.\r\n
\tStrong Protocol real exhaustive programmable checks.\r\n
\tSupports Dynamic as well Static Error Injection scenarios.\r\n
\tBuilt Coverage analysis.\r\n
\tProvides comprehensive API (callbacks) Model BFMs.\r\n
\tGraphical analyzer show transactions debugging.\r\n
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<p><strong>PHY</strong></p>\r\n
\r\n
<ul>\r\n
\t<li>Includes DDR5 training with write-leveling and data-eye training, and I/O pads with impedance calibration logic and data retention capability</li>\r\n
\t<li>Programmable per-bit (PVT compensated) deskew on read and write data paths</li>\r\n
\t<li>RX and TX equalization for heavily loaded systems</li>\r\n
\t<li>Microcontroller-based PHY-independent advanced training that provides flexibility</li>\r\n
\t<li>Low latency for data-intensive applications</li>\r\n
\t<li>Signal integrity, board, and package design guidelines</li>\r\n
</ul>\r\n
\r\n
<p><strong>Controller</strong></p>\r\n
\r\n
<ul>\r\n
\t<li>QoS features allow command prioritization on Arm AMBA 4 AXI and CHI interfaces</li>\r\n
\t<li>Memory controller interface complies with DFI standards up to version 5.1</li>\r\n
</ul>
"""
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<p><strong>Leading-edge IP for high-performance multi-channel memory systems</strong></p>\r\n
\r\n
<p>The DDR5 12.8Gbps MRDIMM Gen2 PHY and controller memory IP system solutions double the performance of DDR5 DRAM. The DDDR5 12.8Gbps design and architecture address the need for greater memory bandwidth to accommodate unprecedented AI processing demands in enterprise and data center applications, including AI in the cloud.</p>\r\n
\r\n
<p>The DDR5 MRDIMM Gen2 IP system solution is available today, ready to enable advanced SoCs with flexible floorplan design options, while at the same time, the architecture allows fine-tuning of power and performance based on individual application requirements.</p>\r\n
\r\n
<p>Cadence supports your SoC/IP integration and development with EDA tools, Verification IP (VIP), and Rapid System Bring-Up software.</p>
"""
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<ul>\r\n
\t<li>The DDR5 12.8Gbps MRDIMM Gen2 PHY and controller memory IP system solutions double the performance of DDR5 DRAM.</li>\r\n
\t<li>The DDDR5 12.8Gbps design and architecture address the need for greater memory bandwidth to accommodate unprecedented AI processing demands in enterprise and data center applications, including AI in the cloud.</li>\r\n
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"text_high_priority" => "DDR5 MRDIMM PHY and Controller Cadence Design Systems Inc."
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Leading-edge IP for high-performance multi-channel memory systems\r\n
\r\n
The DDR5 12.8Gbps MRDIMM Gen2 PHY and controller system solutions double the performance of DRAM. The DDDR5 design architecture address need greater bandwidth to accommodate unprecedented AI processing demands in enterprise data center applications including cloud.\r\n
\r\n
The solution is available today ready enable advanced SoCs with flexible floorplan options while at same time allows fine-tuning power based on individual application requirements.\r\n
\r\n
Cadence supports your SoC/IP integration development EDA tools Verification (VIP) Rapid System Bring-Up software. PHY\r\n
\r\n
\r\n
\tIncludes training write-leveling data-eye I/O pads impedance calibration logic retention capability\r\n
\tProgrammable per-bit (PVT compensated) deskew read write paths\r\n
\tRX TX equalization heavily loaded systems\r\n
\tMicrocontroller-based PHY-independent that provides flexibility\r\n
\tLow latency data-intensive applications\r\n
\tSignal integrity board package guidelines\r\n
\r\n
\r\n
Controller\r\n
\r\n
\r\n
\tQoS features allow command prioritization Arm AMBA 4 AXI CHI interfaces\r\n
\tMemory interface complies DFI standards up version 5.1\r\n
"""
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<ul>\r\n
\t<li>Turn key solution: compression, compaction, memory management</li>\r\n
\t<li>Automatic compressed memory tier</li>\r\n
\t<li>Multi-instance support to match interface throughput</li>\r\n
\t<li>Cache line granularity decompression for highest read performance (proprietary algorithm)</li>\r\n
</ul>
"""
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"overview" => """
<p>DenseMem increases effective CXL Type 3 Device memory capacity by a factor of 2x through transparent, in-line memory compression/decompression with minimal impact to latency and badwidth. DenseMem is available as an area and power efficient drag and drop IP block portable across the latest process nodes.</p>\r\n
\r\n
<p><strong>Applications</strong></p>\r\n
\r\n
<p>Data Center operators at scale regularly employ software memory compression to create an additional memory tier to conserve capacity and interconnect bandwidth. Such operations consume monetizable host node compute cycles. DenseMem offloads compression/ decompression , tranparently creating a new, dynamically adjusting compressed memory tier within the Type 3 Device. DenseMem free up host cycles to service end user workloads. DenseMem supports industry standard compression algorithms for compatibility/ interoperability and alternatively offers propreitary compression algorithms for highest performance. DenseMem AI features adapt performance by adjusting to workloads automatically.</p>\r\n
\r\n
<p><strong>Integration</strong></p>\r\n
\r\n
<p>DenseMem can be integrated into the CXL Type 3 device SoC, between the CXL controller and memory controller logic blocks, supporting both AXI4 and CHI specifications. DenseMem lightweight firmware enables communication with the device over CXL.mem commands when reading and writing pages. DenseMem exposes compressed memory region as an additional Tier in the memory hierarchy, for easy integration into existing linux and software application stacks as well as CXL fabric management software.</p>\r\n
\r\n
<p><strong>Benefits</strong></p>\r\n
\r\n
<p>2-3x effective capacity increase. New compressed memory tier instantiated automatically inside CXL Type 3 device. Turn key solution: Real-time compression/decompression coupled with compaction, and transparent memory management. Operations at main memory speed and throughput. Compatible with AXI4/CHI specifications for easy integration. Intelligent real-time analysis and tuning to adapt to diverse workloads.</p>\r\n
\r\n
<p><strong>Performance / KPI</strong></p>\r\n
\r\n
<table>\r\n
\t<tbody>\r\n
\t\t<tr>\r\n
\t\t\t<td><strong>Feature</strong></td>\r\n
\t\t\t<td><strong>Performance</strong></td>\r\n
\t\t</tr>\r\n
\t\t<tr>\r\n
\t\t\t<td>Compression ratio:</td>\r\n
\t\t\t<td>2-3x across diverse data sets</td>\r\n
\t\t</tr>\r\n
\t\t<tr>\r\n
\t\t\t<td>Frequency:</td>\r\n
\t\t\t<td>1.6GHz (@5nm TSMC)</td>\r\n
\t\t</tr>\r\n
\t\t<tr>\r\n
\t\t\t<td>IP area:</td>\r\n
\t\t\t<td>Starting at 0.23mm<sup>2</sup> (@5nm TSMC) 75% is SRAM</td>\r\n
\t\t</tr>\r\n
\t\t<tr>\r\n
\t\t\t<td>Memory technologies supported:</td>\r\n
\t\t\t<td>(LP)DDR4, (LP)DDR5</td>\r\n
\t\t</tr>\r\n
\t</tbody>\r\n
</table>\r\n
\r\n
<p><strong>System integration of DenseMem</strong></p>\r\n
\r\n
<p>Integrated within a CXL Type 3 device</p>
"""
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<ul>\r\n
\t<li>Turn key solution: compression, compaction, memory management</li>\r\n
\t<li>Automatic compressed memory tier</li>\r\n
\t<li>Multi-instance support to match interface throughput</li>\r\n
\t<li>Cache line granularity decompression for highest read performance (proprietary algorithm)</li>\r\n
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DenseMem increases effective CXL Type 3 Device memory capacity by a factor of 2x through transparent in-line compression/decompression with minimal impact to latency and badwidth. is available as an area power efficient drag drop IP block portable across the latest process nodes.\r\n
\r\n
Applications\r\n
\r\n
Data Center operators at scale regularly employ software compression create additional tier conserve interconnect bandwidth. Such operations consume monetizable host node compute cycles. offloads compression/ decompression tranparently creating new dynamically adjusting compressed within Device. free up cycles service end user workloads. supports industry standard algorithms for compatibility/ interoperability alternatively offers propreitary highest performance. AI features adapt performance workloads automatically.\r\n
\r\n
Integration\r\n
\r\n
DenseMem can be integrated into device SoC between controller logic blocks supporting both AXI4 CHI specifications. lightweight firmware enables communication over CXL.mem commands when reading writing pages. exposes region Tier in hierarchy easy integration existing linux application stacks well fabric management software.\r\n
\r\n
Benefits\r\n
\r\n
2-3x increase. New instantiated automatically inside device. Turn key solution: Real-time coupled compaction management. Operations main speed throughput. Compatible AXI4/CHI specifications integration. Intelligent real-time analysis tuning diverse workloads.\r\n
\r\n
Performance / KPI\r\n
\r\n
\r\n
\t\r\n
\t\t\r\n
\t\t\tFeature\r\n
\t\t\tPerformance\r\n
\t\t\r\n
\t\t\r\n
\t\t\tCompression ratio:\r\n
\t\t\t2-3x data sets\r\n
\t\t\r\n
\t\t\r\n
\t\t\tFrequency:\r\n
\t\t\t1.6GHz (@5nm TSMC)\r\n
\t\t\r\n
\t\t\r\n
\t\t\tIP area:\r\n
\t\t\tStarting 0.23mm2 (@5nm TSMC) 75% SRAM\r\n
\t\t\r\n
\t\t\r\n
\t\t\tMemory technologies supported:\r\n
\t\t\t(LP)DDR4 (LP)DDR5\r\n
\t\t\r\n
\t\r\n
\r\n
\r\n
System DenseMem\r\n
\r\n
Integrated \r\n
\tTurn management\r\n
\tAutomatic tier\r\n
\tMulti-instance support match interface throughput\r\n
\tCache line granularity read (proprietary algorithm)\r\n
"""
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<ul>\r\n
\t<li>PSRAM:\r\n
\t<ul>\r\n
\t\t<li>Supports rates from 200Mbps up to 1600Mbps</li>\r\n
\t\t<li>x8/x16 data bus width extendable</li>\r\n
\t\t<li>1.8V/2.5V IO devices</li>\r\n
\t\t<li>Multiple drive strengths adjustable</li>\r\n
\t\t<li>Supports read and write timing adjustments with soft calibration</li>\r\n
\t\t<li>Low latency with programmable timings for secure data handling</li>\r\n
\t\t<li>Per bit de-skew support for high speed</li>\r\n
\t\t<li>Supports point-to-point memory sub-systems and multi-rank</li>\r\n
\t\t<li>Supports ZQ calibration to calibrate driver output resistance and on-die termination resistance</li>\r\n
\t\t<li>PVT compensation and timing calibration for all corner reliability</li>\r\n
\t\t<li>At speed BIST, scan insertion</li>\r\n
\t\t<li>Various power-down modes for low power including self-refresh support</li>\r\n
\t\t<li>Low jitter with superior noise rejection</li>\r\n
\t\t<li>APB Port register access interface</li>\r\n
\t</ul>\r\n
\t</li>\r\n
\t<li>RPC:\r\n
\t<ul>\r\n
\t\t<li>Fully compliant with standards</li>\r\n
\t\t<li>Compliant with DFI specification with the clock rate ratio of 1:2 between controller and PHY</li>\r\n
\t\t<li>Controller CPU bus core could be carried on AXI bus interface</li>\r\n
\t\t<li>Supports 4-port switching with respective FIFO set space for each AXI port</li>\r\n
\t\t<li>Automatic initialization and refresh procedure</li>\r\n
\t\t<li>Pipeline design enables high clock rates with minimal routing constraints</li>\r\n
\t\t<li>Run-time configurable timing parameters</li>\r\n
\t\t<li>Supports RPC device self-refresh and half-refresh mode</li>\r\n
\t\t<li>Source code license available in Verilog HDL</li>\r\n
\t\t<li>Core data path tailored to FPGA family and/or ASIC library</li>\r\n
\t</ul>\r\n
\t</li>\r\n
</ul>
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<p>The DDR IP Mixed-Signal MR PSRAM PHY and RPC PHY provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible PSRAM/RPC devices. It is optimized for low-power and high-speed applications with robust timing and small silicon area. The PSRAM PHY supports AP memory UHS/OPI PSRAM components on the market, and the RPC PHY supports ETRON components on the market. The PHY components contain PSRAM-/RPC-specialized IO devices for utility and functionality, critical timing synchronization module (TSM), low-jitter PLL, the TX, and RX logic control for the interface.</p>\r\n
\r\n
<p>The’s comprehensive product portfolio also includes full GDS delivery, signal integrity and power integrity (SI/PI) analysis, verification models, prototyping support, and simulation tools. These offerings empower customers to accelerate development cycles, ensure robust performance, and stay ahead in the competitive landscape of high-performance memory solutions.</p>
"""
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<ul>\r\n
\t<li>The DDR IP Mixed-Signal MR PSRAM PHY and RPC PHY provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible PSRAM/RPC devices</li>\r\n
\t<li>It is optimized for low-power and high-speed applications with robust timing and small silicon area</li>\r\n
\t<li>The PSRAM PHY supports AP memory UHS/OPI PSRAM components on the market, and the RPC PHY supports ETRON components on the market</li>\r\n
</ul>
"""
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The DDR IP Mixed-Signal MR PSRAM PHY and RPC provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible PSRAM/RPC devices. It is optimized low-power high-speed applications with robust timing small silicon area. supports AP memory UHS/OPI components on the market ETRON market. contain PSRAM-/RPC-specialized IO devices utility functionality critical synchronization module (TSM) low-jitter PLL TX RX logic control interface.\r\n
\r\n
The’s comprehensive product portfolio also includes full GDS delivery signal integrity power (SI/PI) analysis verification models prototyping support simulation tools. These offerings empower customers accelerate development cycles ensure performance stay ahead in competitive landscape of high-performance solutions. \r\n
\tPSRAM:\r\n
\t\r\n
\t\tSupports rates from 200Mbps up 1600Mbps\r\n
\t\tx8/x16 data bus width extendable\r\n
\t\t1.8V/2.5V devices\r\n
\t\tMultiple drive strengths adjustable\r\n
\t\tSupports read write adjustments soft calibration\r\n
\t\tLow latency programmable timings secure handling\r\n
\t\tPer bit de-skew high speed\r\n
\t\tSupports point-to-point sub-systems multi-rank\r\n
\t\tSupports ZQ calibration calibrate driver output resistance on-die termination resistance\r\n
\t\tPVT compensation all corner reliability\r\n
\t\tAt speed BIST scan insertion\r\n
\t\tVarious power-down modes low including self-refresh support\r\n
\t\tLow jitter superior noise rejection\r\n
\t\tAPB Port register interface\r\n
\t\r\n
\t\r\n
\tRPC:\r\n
\t\r\n
\t\tFully compliant standards\r\n
\t\tCompliant DFI specification clock rate ratio 1:2 between controller PHY\r\n
\t\tController CPU core could be carried AXI interface\r\n
\t\tSupports 4-port switching respective FIFO set space each port\r\n
\t\tAutomatic initialization refresh procedure\r\n
\t\tPipeline design enables minimal routing constraints\r\n
\t\tRun-time configurable parameters\r\n
\t\tSupports device half-refresh mode\r\n
\t\tSource code license available Verilog HDL\r\n
\t\tCore path tailored FPGA family and/or ASIC library\r\n
\t\r\n
\t\r\n
"""
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"updated_at" => 1743714121
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<ul>\r\n
\t<li>Supports DDR5 MRDIMMs, standard DDR5/4 LRDIMMs/RDIMMs/UDIMMs and standard DDR5/4 signaling, rates from 20Mbps up to 9600Mbps (MRDIMM DDR5)</li>\r\n
\t<li>x16/x32/x64/x72/x80 data bus width extendable, supporting both MRDIMM and standard DDR5/4 DIMMs, or standard DDR5/4 SDRAM devices</li>\r\n
\t<li>1.2V(DDR4)/1.1V(DDR5) JEDEC I/O standard, supporting 1.2V POD_12 and 1.1V POD_11 I/Os</li>\r\n
\t<li>Supports DDR5 dual channel mode, dual 32-bits data +8-bits ECC</li>\r\n
\t<li>Supports CA training, CS training, and write leveling training modes</li>\r\n
\t<li>Supports Write FFE and Read DFE equalization:\r\n
\t<ul>\r\n
\t\t<li>1-tap FFE</li>\r\n
\t\t<li>6-/4-tap DFE</li>\r\n
\t</ul>\r\n
\t</li>\r\n
\t<li>Both Read and Write Per bit de-skew support</li>\r\n
\t<li>Supports multiple types of training modes for stable working: CA/CS Training, Write Leveling, DQS Gate Training, ZQ Calibration, Read/Write Training, Rx/Tx Vref Training, QCS/QCA Training for DDR5 RDIMM/LRDIMM/MRDIMM, MREP/DWL/MRD/MWD Training for DDR4 LRDIMM, MRE/DWL/HWL/MRD/MWD for DDR5 LRDIMM</li>\r\n
\t<li>PVT compensation and timing calibration for all corner reliability</li>\r\n
\t<li>At-speed BIST for PAD and internal loopback modes</li>\r\n
\t<li>Supports multiple DFT methods: At-speed Scan, Stuck-at Scan, Boundary Scan</li>\r\n
\t<li>Various power-down modes for low-power including self-refresh support</li>\r\n
\t<li>Low-jitter PLL with small area, wide input frequency range and isolated analog supply, allowing for excellent supply rejection in noisy SoC applications</li>\r\n
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<p>The DDR IP Mixed-Signal MRDIMM DDR5 PHY and DDR5/4 Combo PHY provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible SDRAM or MRDIMM/ RDIMM/ LRDIMM/ UDIMM DDR5 devices. It is optimized for low-power and high-speed applications with robust timing and small silicon area. It supports all JEDEC DDR5/4 SDRAM components in the market. The PHY components contain DDR-specialized functional and utility high-performance I/Os, critical timing synchronization modules (TSM), and low power/jitter DLLs with programmable fine-grain control for any SDRAM interface.</p>\r\n
\r\n
<p>The’s comprehensive product portfolio also includes full GDS delivery, signal integrity and power integrity (SI/PI) analysis, verification models, prototyping support, and simulation tools. These offerings empower customers to accelerate development cycles, ensure robust performance, and stay ahead in the competitive landscape of high-performance memory solutions.</p>
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<ul>\r\n
\t<li>The DDR IP Mixed-Signal MRDIMM DDR5 PHY and DDR5/4 Combo PHY provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible SDRAM or MRDIMM/ RDIMM/ LRDIMM/ UDIMM DDR5 devices</li>\r\n
\t<li>It is optimized for low-power and high-speed applications with robust timing and small silicon area</li>\r\n
\t<li>It supports all JEDEC DDR5/4 SDRAM components in the market</li>\r\n
</ul>
"""
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"text_low_priority" => """
The DDR IP Mixed-Signal MRDIMM DDR5 PHY and DDR5/4 Combo provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible SDRAM or MRDIMM/ RDIMM/ LRDIMM/ UDIMM devices. It is optimized low-power high-speed applications with robust timing small silicon area. supports all components in the market. contain DDR-specialized functional utility high-performance I/Os critical synchronization modules (TSM) low power/jitter DLLs programmable fine-grain control any interface.\r\n
\r\n
The’s comprehensive product portfolio also includes full GDS delivery signal integrity power (SI/PI) analysis verification models prototyping support simulation tools. These offerings empower customers accelerate development cycles ensure performance stay ahead competitive landscape of memory solutions. \r\n
\tSupports MRDIMMs standard LRDIMMs/RDIMMs/UDIMMs signaling rates from 20Mbps up 9600Mbps (MRDIMM DDR5)\r\n
\tx16/x32/x64/x72/x80 data bus width extendable supporting both DIMMs devices\r\n
\t1.2V(DDR4)/1.1V(DDR5) I/O 1.2V POD_12 1.1V POD_11 I/Os\r\n
\tSupports dual channel mode 32-bits +8-bits ECC\r\n
\tSupports CA training CS write leveling modes\r\n
\tSupports Write FFE Read DFE equalization:\r\n
\t\r\n
\t\t1-tap FFE\r\n
\t\t6-/4-tap DFE\r\n
\t\r\n
\t\r\n
\tBoth Per bit de-skew support\r\n
\tSupports multiple types modes stable working: CA/CS Training Leveling DQS Gate ZQ Calibration Read/Write Rx/Tx Vref QCS/QCA RDIMM/LRDIMM/MRDIMM MREP/DWL/MRD/MWD DDR4 LRDIMM MRE/DWL/HWL/MRD/MWD LRDIMM\r\n
\tPVT compensation calibration corner reliability\r\n
\tAt-speed BIST PAD internal loopback DFT methods: At-speed Scan Stuck-at Boundary Scan\r\n
\tVarious power-down including self-refresh support\r\n
\tLow-jitter PLL area wide input frequency range isolated analog supply allowing excellent rejection noisy SoC applications\r\n
"""
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<ul>\r\n
\t<li>Data rate up to 20Gbps (GDDR6) and 24Gbps (GDDR6X)</li>\r\n
\t<li>Pseudo open drain (POD‐135) compatible outputs</li>\r\n
\t<li>Driver strength and ODT auto calibration</li>\r\n
\t<li>PHY independent auto/software Command Address Training</li>\r\n
\t<li>PHY independent auto WCK2CK/Read/Write Training</li>\r\n
\t<li>PHY independent software Read/Write Training</li>\r\n
\t<li>PHY independent RX VREF Training</li>\r\n
\t<li>Supports WDBI/RDBI/CABI functions</li>\r\n
\t<li>Supports EDC QDR/DDR modes</li>\r\n
\t<li>Rx DFE for data inputs, with receiver characteristics programmable per pin</li>\r\n
\t<li>Supports both Write and Read CRC</li>\r\n
\t<li>Per bit Tx and Rx data phase delay and VREF adjustment</li>\r\n
\t<li>Internal high-performance low-jitter PLL</li>\r\n
\t<li>Tx de-emphasis EQ and Rx DFE EQ to improve signal integrity</li>\r\n
\t<li>Supports both Quad data rate (QDR) and double data rate (DDR) data (WCK) modes</li>\r\n
\t<li>Supports dynamic Read Training/Write Training with auto-refresh synchronization function</li>\r\n
\t<li>Accommodates Voltage/Temperature timing drift</li>\r\n
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<br />\r\n
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<br />\r\n
The LPDDR5X/5/4X/4 Combo OPHY features a state-of-art mixed-signal architecture that addresses the challenges of DRAM integration in high-performance and low-power environments. This architecture enables LPDDR5/4 Combo OPHY to overcome issues with long-term impedance drift and clock phase drift, allowing impedance and clock phase updates without interruption of data traffic. The programmable timing at the OPHY boundary combines flexibility with analog precision, resulting in low read/write latency between OMC and the LPDDR5X/5/4X/4 DRAM without sacrificing performance.<br />\r\n
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<ul>\r\n
\t<li>Compatible with JEDEC standard DDR2/DDR3/LPDDR (or Mobile DDR)/ /LPDDR2/LPDDR3 SDRAMs</li>\r\n
\t<li>Operating range of 100MHz (200Mb/s) to 533MHz(1066Mb/s) in DDR2/DDR3/LPDDR2/LPDDR3 modes</li>\r\n
\t<li>Operating range of DC to 200MHz in Mobile DDR mode</li>\r\n
\t<li>PHY Utility Block (PUBL) component</li>\r\n
\t<li>DFI 2.1 compliant interface to controller</li>\r\n
\t<li>At-speed loopback testing</li>\r\n
\t<li>Configurable external data bus widths in 8-bit increments</li>\r\n
\t<li>Permits operating with SDRAMs using data widths narrower than the implemented data width</li>\r\n
\t<li>Programmable output and ODT impedance with dynamic PVT compensation</li>\r\n
\t<li>Embedded Dynamic Drift Detection in the PHY to facilitate Dynamic Drift Compensation with the controller</li>\r\n
\t<li>Utilizes Master and Slave DLLs for precise timing management</li>\r\n
\t<li>Lane-based architecture (Byte Lane, Command Lane)</li>\r\n
\t<li>Test modes supporting IDDq and DLL characterization</li>\r\n
\t<li>Library-based hard-IP PHY to permit maximum flexibility while ensuring high data rates</li>\r\n
\t<li>Full documentation including physical implementation guide</li>\r\n
\t<li>Includes all required views for a typical ASIC design flow</li>\r\n
</ul>
"""
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"overview" => "<p>The DDR multiPHYs are mixed-signal PHY IP cores that supply the complete physical interface to JEDEC standard DDR2, DDR3, LPDDR2, LPDDR3 SDRAM memories up to 1066 Mbps data rates and Mobile DDR (also referred to as mDDR and LPDDR) SDRAM memories up to 400 Mbps data rates. This particular PHY supports switching between DDR2 and DDR3 memories once a chip is in production. This “Lite” PHY does not go up to the full 1600 Mbps data rate targeted for DDR3. Instead, this is an area and feature optimized DDR2/DDR3 PHY for customers that want to go to market with DDR2 interfaces up to 1066 Mbps and also want an insurance policy against equivalent DDR3 devices becoming cheaper while their chip remains in the market. As part of the optimization of this PHY, a small number of the new features for DDR3, such as write leveling, are not supported as they are not supported by DDR2 SDRAMs.</p>"
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<ul>\r\n
\t<li>Compatible with JEDEC standard DDR2/DDR3/LPDDR (or Mobile DDR)/ /LPDDR2/LPDDR3 SDRAMs</li>\r\n
\t<li>Operating range of 100MHz (200Mb/s) to 533MHz(1066Mb/s) in DDR2/DDR3/LPDDR2/LPDDR3 modes</li>\r\n
\t<li>Operating range of DC to 200MHz in Mobile DDR mode</li>\r\n
\t<li>PHY Utility Block (PUBL) component</li>\r\n
</ul>
"""
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"text_high_priority" => "DDR multi PHY VeriSyno Microelectronics Co. Ltd."
"text_low_priority" => """
The DDR multiPHYs are mixed-signal PHY IP cores that supply the complete physical interface to JEDEC standard DDR2 DDR3 LPDDR2 LPDDR3 SDRAM memories up 1066 Mbps data rates and Mobile (also referred as mDDR LPDDR) 400 rates. This particular supports switching between once a chip is in production. “Lite” does not go full 1600 rate targeted for DDR3. Instead this an area feature optimized DDR2/DDR3 customers want market with interfaces also insurance policy against equivalent devices becoming cheaper while their remains market. As part of optimization small number new features such write leveling supported they by SDRAMs. \r\n
\tCompatible DDR2/DDR3/LPDDR (or DDR)/ /LPDDR2/LPDDR3 SDRAMs\r\n
\tOperating range 100MHz (200Mb/s) 533MHz(1066Mb/s) DDR2/DDR3/LPDDR2/LPDDR3 modes\r\n
\tOperating DC 200MHz mode\r\n
\tPHY Utility Block (PUBL) component\r\n
\tDFI 2.1 compliant controller\r\n
\tAt-speed loopback testing\r\n
\tConfigurable external bus widths 8-bit increments\r\n
\tPermits operating SDRAMs using narrower than implemented width\r\n
\tProgrammable output ODT impedance dynamic PVT compensation\r\n
\tEmbedded Dynamic Drift Detection facilitate Compensation controller\r\n
\tUtilizes Master Slave DLLs precise timing management\r\n
\tLane-based architecture (Byte Lane Command Lane)\r\n
\tTest modes supporting IDDq DLL characterization\r\n
\tLibrary-based hard-IP permit maximum flexibility ensuring high rates\r\n
\tFull documentation including implementation guide\r\n
\tIncludes all required views typical ASIC design flow\r\n
"""
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"keyfeatures" => "<ul><li>? DDR2/DDR3/DDR3U/DDR3L/LVCMOS operating modes </li><li>? Compatible with JEDEC standard DDR2/DDR3/DDR3U/DDR3L SDRAMs </li><li>? Scalable performance from DDR2-667 through DDR3-1600 </li><li>? Maximum controller clock frequency of 400MHz resulting in maximum SDRAM data rate of 1600 Mbps </li><li>? Data path width scales in 8-bit increments </li><li>? Delivery of product as hardened IP components allows precise control of timing critical delay and skew paths </li><li>? Includes embedded PLL and DDLs necessary to meet timing specifications </li><li>? Multiple memory-rank support, up to four ranks </li><li>? DDR3 PHY-Controller interface runs at 1/4 the memory baud rate, simplifying core logic timing constraints </li><li>? Write leveling delay line (WLDL) to compensate address and control versus data delays of up to 1 clock cycle or 2500ps </li><li>? Write and read bit delay lines (BDLs) compensate per-bit delay skew of up to 600ps at fast PVT; delay resolution approximately 15ps under typical conditions </li><li>? Locally calibrated master and slave delay lines minimize OCV and ACLV effects, and accommodate V, T timing drift; delay resolution approximately 15ps under typical conditions </li><li>? At-speed loopback testing on both the address and data channels </li><li>? Delay line oscillator test mode </li><li>? MUX-scan ATPG</li></ul>"
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"overview" => "The DDR3/2 PHY is a complete mixed-signal IP solution designed to provide DDR 3/2 SDRAM connectivity in a System-On-a-Chip (SOC) design targeted to a specific fabrication process. The DDR3/2 PHY supports a range of DDR3 SDRAM speeds, from DDR3-667 through DDR3-1600, with backward compatibility provided for DDR2-667 through DDR2-1066 devices. Targeted toward supporting x8 and x16 DDR3 SDRAM components, DDR3/2 PHY supports interfaces of varying widths, from a minimum of 8 bits wide, in 8-bit increments. Delivered to customers as hardened IP components— Address/Command, DATX8, and SSTL I/O Library—implementations of the DDR3/2 PHY are compatible with JEDEC DDR2 and DDR3 SDRAMs, helping ensure customer success."
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<ul><li>? DDR2/DDR3/DDR3U/DDR3L/LVCMOS operating modes</li>\n
<li>? Compatible with JEDEC standard DDR2/DDR3/DDR3U/DDR3L SDRAMs</li>\n
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"text_high_priority" => "DDR3/2 PHY VeriSyno Microelectronics Co. Ltd."
"text_low_priority" => "The DDR3/2 PHY is a complete mixed-signal IP solution designed to provide DDR 3/2 SDRAM connectivity in System-On-a-Chip (SOC) design targeted specific fabrication process. supports range of DDR3 speeds from DDR3-667 through DDR3-1600 with backward compatibility provided for DDR2-667 DDR2-1066 devices. Targeted toward supporting x8 and x16 components interfaces varying widths minimum 8 bits wide 8-bit increments. Delivered customers as hardened components— Address/Command DATX8 SSTL I/O Library—implementations the are compatible JEDEC DDR2 SDRAMs helping ensure customer success. DDR2/DDR3/DDR3U/DDR3L/LVCMOS operating modes Compatible standard DDR2/DDR3/DDR3U/DDR3L Scalable performance Maximum controller clock frequency 400MHz resulting maximum data rate 1600 Mbps Data path width scales increments Delivery product allows precise control timing critical delay skew paths Includes embedded PLL DDLs necessary meet specifications Multiple memory-rank support up four ranks PHY-Controller interface runs at 1/4 memory baud simplifying core logic constraints Write leveling line (WLDL) compensate address versus delays 1 cycle or 2500ps read bit lines (BDLs) per-bit 600ps fast PVT; resolution approximately 15ps under typical conditions Locally calibrated master slave minimize OCV ACLV effects accommodate V T drift; At-speed loopback testing on both channels Delay oscillator test mode MUX-scan ATPG"
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DDR multi PHY
- Compatible with JEDEC standard DDR2/DDR3/LPDDR (or Mobile DDR)/ /LPDDR2/LPDDR3 SDRAMs
- Operating range of 100MHz (200Mb/s) to 533MHz(1066Mb/s) in DDR2/DDR3/LPDDR2/LPDDR3 modes
- Operating range of DC to 200MHz in Mobile DDR mode
- PHY Utility Block (PUBL) component
-
DDR3/2 PHY
- ? DDR2/DDR3/DDR3U/DDR3L/LVCMOS operating modes
- ? Compatible with JEDEC standard DDR2/DDR3/DDR3U/DDR3L SDRAMs
- ? Scalable performance from DDR2-667 through DDR3-1600
- ? Maximum controller clock frequency of 400MHz resulting in maximum SDRAM data rate of 1600 Mbps