Thermal Diode on TSMC CLN55GP

Overview

The ABIBJT55 remote thermal diode macro is implemented using bipolar and IO devices. The diode resides inside the IO ring of two signal pads, occupying no core area. In order to maximize ease of use, the diode incorporates a proprietary ESD structure, which is proven in several generations of processes.

Functional Specification

Key Features

  • Implemented with Analog Bits’ proprietary architecture
  • Fully integrated inside customer-specified IO ring
  • Occupies no core area

Technical Specifications

Foundry, Node
TSMC CLN55GP
TSMC
Pre-Silicon: 5nm
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Semiconductor IP