Analysts Debate Latest U.S. Export Controls
By Alan Patterson, EETimes (October 18, 2023)
The latest round of export controls announced by the U.S. government on semiconductors and chipmaking tools are “not welcome,” according to an analyst commenting to EE Times. Another said the U.S. may use the sanctions to win improved market access and IP protection in a top-level meeting with China next month.
The new rules reinforce the Oct. 7, 2022, restrictions on China’s ability to both purchase and manufacture high-end chips critical for military advantage, the Department of Commerce (DoC) said yesterday in prepared remarks. The updates, which take effect next month, are necessary to maintain the effectiveness of the Oct. 7 controls, close loopholes and ensure they remain durable, the DoC said.
To read the full article, click here
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- US Tightens Chip Export Screws on Huawei
- China's Semiconductor Industry to Brace for Impact as SMIC Assesses Export Restrictions Placed by U.S., Says TrendForce
- Intel CEO Voices Concerns About CHIPS Funds, Export Controls
- New 8-Bit One-Time-Programmable Microcontrollers From Toshiba Controls Small Electronic Home Appliances
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack