Tenstorrent Gains Momentum in Asia With Rapidus Partnership
By Sally Ward-Foxton, EETimes (November 27, 2023)
SANTA CLARA, California—“When we met Rapidus for the first time, they said something really exciting: They want to speed up the iteration rate of making new technologies, and they want to focus in the first order on the speed of taping out the product in hand, rather than mass production and volume, and I think that is a really good focus,” Tenstorrent CEO Jim Keller said, speaking at a signing ceremony held this month to mark the company’s partnership with fledgling Japanese foundry Rapidus.
The deal with Rapidus marks Tenstorrent’s fourth public partnership with an Asian chip firm. The startup also has IP-licensing deals with companies, including LG and Korean automotive SoC maker BOS Semiconductor. Hyundai has also said it will use Tenstorrent tech across its portfolio. The company is also committed to building a CPU and R&D team in Japan, given the exceptional talent base in Japan, and Japan’s history of high-performance computing, EE Times has learned.
To read the full article, click here
Related Semiconductor IP
- USB 20Gbps Device Controller
- AGILEX 7 R-Tile Gen5 NVMe Host IP
- 100G PAM4 Serdes PHY - 14nm
- Bluetooth Low Energy Subsystem IP
- Multi-core capable 64-bit RISC-V CPU with vector extensions
Related News
- Orthogone Technologies Announces Strategic Distribution Partnership with Mettlesemi Systems and Technologies to Deliver Ultra-Low Latency FPGA Solutions in India and key Asia-Pacific Markets.
- AMBA Interconnect Technology Gains Further Industry Momentum
- LSI Logic Gains Momentum in Korea as Pulsus Deploys Products Using ZSP400
- CEVA Demonstrates Significant Asia-Pac Momentum With New Customer Wins At Top Asia Pacific Companies
Latest News
- IntoPIX & Altera Unlock New Levels Of Efficiency For JPEG XS On Agilex At IBC 2025
- Perceptia Begins Port of pPLL03 to Samsung 8nm Process Technology
- Efinix® Doubles Titanium Product Line
- SmartSoC Solutions Partners with Cortus to Advance Chip Design and Manufacturing for SIM Cards, Smart Cards, Banking Cards, and E-Passports in India
- Fraunhofer IIS and ARRI announce partnership for post-production workflows at IBC 2025