Silicon Wave decreases customer development time with new low-power bluetooth reference design kit for its second generation chipset

San Diego - December 10, 2001 - Silicon Wave, Inc., a leading designer and provider of RF communication system components and software, today announced the availability of their low power Bluetooth Reference Design Kit for the company's recently announced second-generation SiW1701TM Radio Modem and SiW1750TM Baseband Processor. The Reference Design Kit is a comprehensive package that enables a customer to immediately start designing a product using Silicon Wave's second-generation chipset. Targeted at notebook and desktop PC markets, PDAs and printers this new reference design reduces risks in developing RF designs and accelerates customer's products to market.

"Our Reference Design Kit is yet another key milestone for Silicon Wave as we deploy our second-generation radio modems and baseband processors," said Steve Brown, vice president, Advanced Products and Applications, at Silicon Wave. "Not only are we helping our customers reduce development time but we are minimizing design risk by offering a proven system solution."

Silicon Wave's Bluetooth Reference Design Kit includes circuit schematic, Bill of Material (BOM), PCB layout, component selection criteria and an actual working Bluetooth Specification Version 1.1 qualified 15mm by 19mm module based on the reference design. The reference module design supports both UART and USB interfaces and is a complete Bluetooth solution designed for low cost manufacturing using standard PCB layout and materials.

The SiW1701 is a fully integrated single-chip radio modem with ultra-low standby and active power consumption, making it ideal for mobile applications. The SiW1750 is an ARM® core-based Bluetooth baseband processor that runs Silicon Wave's embedded protocol stack. This complete system solution consisting of the SiW1701, SiW1750 and software provides an unprecedented level of low power consumption during Bluetooth operation. It also provides maximum data throughput over an extended temperature range with the highest levels of interoperability and connection reliability at the lowest cost.