Samsung, Toshiba Detail AI Chips
ISSCC papers target smartphones, cars
By Rick Merritt, EETimes
February 20, 2019
SAN FRANCISCO — Samsung described a new neural network accelerator for smartphones that matches blocks from rivals such as Huawei. Toshiba detailed one for self-driving cars that pulls ahead of competitors such as Intel’s Mobileye at the International Solid-State Circuits Conference here.
A 5.5mm2 block in the latest 8nm Exynos chip delivers 1.9 Tera-operations/second using 8-bot precision running at up to 933 MHz, said Jinook Song, a Samsung AI engineer. That’s about the rating for the latest Kirin processor in Huawei phones and the latest commercial IP blocks.
To read the full article, click here
Related Semiconductor IP
- RISC-V AI Acceleration Platform - Scalable, standards-aligned soft chiplet IP
- AI IP Core
- High-Performance Memory Expansion IP for AI Accelerators
- High-performance AI dataflow processor with scalable vector compute capabilities
- Lowest Power and Cost End Point AI Accelerator
Related News
- Samsung Foundry Adopts Leading Voltage-Timing Signoff Solution from Synopsys and Ansys for Advanced-Node, Energy-Efficient Chips
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
- Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
Latest News
- Arteris Selected by NanoXplore for Space Applications
- Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
- Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration
- Morse Micro Secures $88 Million AUD Series C Funding to Lead the Next Era of IoT
- Altera Appoints Sandeep Nayyar as Chief Financial Officer