Multicore designs might force Intel off its bus; Integrated memory controllers may loom large in future designs
Multicore designs might force Intel off its bus; Integrated memory controllers may loom large in future designs
By Tom Krazit, IDG News Service
December 16, 2004
As Intel moves in step with the rest of the chip industry toward the multicore design era, it is preparing to overhaul the memory bus architecture that has served it well for so many years, according to company executives and analysts.
Multicore processor designs are considered the solution to the performance scaling problem brought on by increased amounts of power leakage in modern chips. Transistors are now so small that increasing a chip's frequency, and therefore the amount of power it consumes, is not the simple exercise that kept companies like Intel going for many years.
However, in order to fully realize the performance gains provided by multiple processor cores, chip companies need to find a way to deliver enough data to the processor from the main memory to keep those cores as productive as possible.
Intel's current front-side system bus design should be able to keep as many as four cores satisfied, depending on the frequency of those cores, said Stephen Pawlowski, an Intel senior fellow, at a recent briefing on Intel's multicore strategy
Click here to read more ....
Related Semiconductor IP
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
- SHA-256 Secure Hash Algorithm IP Core
- EdDSA Curve25519 signature generation engine
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
Related News
- Synopsys Collaborates with Keysight Technologies to Deliver Integrated Custom Design Flow for 5G Designs
- sureCore announces range of off-the-shelf, ultra-low power memory IP to help fast-track power critical designs
- Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
- Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
Latest News
- Analog Bits Demonstrates Real-Time On-Chip Power Sensing and Delivery on TSMC N2P Process at TSMC 2026 Technology Symposiums
- TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
- Faraday Delivers IP Solutions to Enable Endpoint AI Based on UMC’s 28nm SST eFlash
- AiM Future Partners with Metsakuur Company to Commercialize NPU-Integrated Hardware
- ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025