InterDigital(R) and Nokia Agree to End English Court Actions
KING OF PRUSSIA, Pa. -- July 2, 2008--InterDigital, Inc. (NASDAQ:IDCC) announces that its wholly-owned subsidiary, InterDigital Technology Corporation, and Nokia Corporation have agreed to end two legal actions in the English Courts.
The cases concerned whether certain patents owned by the parties are essential to the UMTS 3G mobile telephony standard.
Nokia Corporation had brought suit against InterDigital Technology Corporation in the English High Court on July 29, 2005 (commonly referred to as UKII) alleging that certain of InterDigital Technology Corporation's UK patents declared to the UMTS 3G standard were not essential to that standard.
InterDigital Technology Corporation had brought suit against Nokia Corporation in the English High Court on December 19, 2006 (commonly referred to as UKIII) alleging that certain of Nokia's UK patents declared to the UMTS 3G standard were not essential to that standard. Nokia Siemens Networks Oy was joined to the action on October 17, 2007, as some of the Nokia patents in suit were transferred to Nokia Siemens Networks Oy.
The details of the agreement are confidential between the parties. Ongoing US litigation between Nokia and InterDigital continues.
About InterDigital
InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(R) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.
For more information, visit: www.interdigital.com
Related Semiconductor IP
- ISO/IEC 7816 Verification IP
- 50MHz to 800MHz Integer-N RC Phase-Locked Loop on SMIC 55nm LL
- Simulation VIP for AMBA CHI-C2C
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
Related News
- InterDigital Receives Notice That Commission Found No Violation of Section 337 in ITC Patent Infringement Action against Nokia
- InterDigital Files Complaint Against Nokia, Huawei and ZTE With International Trade Commission
- InterDigital Prevails in Appeal of Adverse U.S. International Trade Commission Decision in Dispute with Nokia
- InterDigital Files New Complaint Against Huawei, Nokia, Samsung and ZTE with U.S. International Trade Commission
Latest News
- Quintauris and Andes Technology Partner to Scale RISC-V Ecosystem
- Europe Achieves a Key Milestone with the Europe’s First Out-of-Order RISC-V Processor chip, with the eProcessor Project
- Intel Unveils Panther Lake Architecture: First AI PC Platform Built on 18A
- TSMC September 2025 Revenue Report
- Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions