How Small Will Apple Inc. Go?
By Ashraf Eassa, The Motley Fool
February 16, 2014
Taiwan Semiconductor (NYSE: TSM ) has been rather vocal about the fact that it is now in "high volume manufacturing" of its 20-nanometer SoC process. The 20-nanometer process, according to TSMC, offers a 1.9x improvement in gate-density, 15% performance improvement at the same power or 30% lower power at the same performance compared to the company's 28-nanometer HPM process, and is expected to really begin to ramp in volume during the second half of 2014 and into 2015, as shown below.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN20SOC 20nm LPDDR5 PHY - 3200Mbps
- TSMC CLN20SOC 20nm LPDDR4 PHY - 2933Mbps
- TSMC CLN20SOC 20nm LPDDR3 PHY - 2133Mbps
- TSMC CLN20SOC 20nm DDR5 PHY - 3200Mbps
- TSMC CLN20SOC 20nm DDR4 PHY - 2933Mbps
Related News
- How Apple will dodge an Imagination lawsuit
- Reading the tea leaves: How deep will EDA losses go?
- China, Not Apple, Is Way to Go, Says mCube CEO
- How Will Deep Learning Change SoCs?
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications