How Small Will Apple Inc. Go?
By Ashraf Eassa, The Motley Fool
February 16, 2014
Taiwan Semiconductor (NYSE: TSM ) has been rather vocal about the fact that it is now in "high volume manufacturing" of its 20-nanometer SoC process. The 20-nanometer process, according to TSMC, offers a 1.9x improvement in gate-density, 15% performance improvement at the same power or 30% lower power at the same performance compared to the company's 28-nanometer HPM process, and is expected to really begin to ramp in volume during the second half of 2014 and into 2015, as shown below.
To read the full article, click here
Related Semiconductor IP
- TSMC CLN20SOC 20nm Spread Spectrum PLL - 306MHz-1530MHz
- TSMC CLN20SOC 20nm Spread Spectrum PLL - 153MHz-766MHz
- TSMC CLN20SOC 20nm Spread Spectrum PLL - 612MHz-3060MHz
- TSMC CLN20SOC 20nm Multi Phase DLL - 350MHz-1750MHz
- TSMC CLN20SOC 20nm Multi Phase DLL - 175MHz-875MHz
Related News
- How Apple will dodge an Imagination lawsuit
- Reading the tea leaves: How deep will EDA losses go?
- China, Not Apple, Is Way to Go, Says mCube CEO
- How Will Deep Learning Change SoCs?
Latest News
- DDR4 and LPDDR4 Supply Tightens Sharply in 2H25 as Structural Shortage Drives Strong Price Surge, Says TrendForce
- Ceva, Inc. Announces Second Quarter 2025 Financial Results
- bitHuman Launches the World's First CPU-Based Avatar SDK for Arm and x86-No GPUs Required
- SMIC Reports 2025 Second Quarter Results
- Cyient Semiconductors Enters Strategic Channel Partnership with GlobalFoundries