Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications
GRASSE, France -- September 28, 2017 -- Gridbee Communications S.A.S. specialist in wireless communication IC development is pleased to announce the release of its GDB1000 SoC for Sub-GHz wireless communication solution and compliant with IEEE 802.15.4g/u/v. This is the first SoC capable of both FSK / OFDM modulations and embedding all processing power (MCU and flash memory) necessary for Smart Grid, Smart Cities and Industrial applications. The device provides 2 power amplifier outputs (one internal PA delivering + 18dBm and a second for external PA up to +30dBm) and exhibits a receiver sensitivity of -98dBm @800kb/s and -104dBm @400kb/s OFDM data rate. The high link budget guarantees successful communication over 2.5km distance at 800kb/s.
Gridbee GDB1000 offers both MR-FSK and MR-OFDM modulations and supports data rate from 50kb/s up to 800kb/s for distance ranging from few hundreds of meters to a few kilometers. GDB1000 features a large amount of memory (768kB of flash, 128kB of RAM), a full set of standard interfaces (USB, SPI, I²C, UART, etc.) and a 256 bits capable hardware AES encryption engine enabling secured, fast and reliable software upgrade over the air. Leveraging the high performance, power efficient capabilities of the GDB1000 processor, customers can run a very efficient and secure mesh network while processing data from the edge allowing for faster decision making.
"We are delighted to have reached this key technical milestone. We have enabled our global smart metering customers further with this state of the art SoC. The GDB1000 anticipates and enables more data exchange in IoT applications and our chip will have strong demand from multiple different applications," said, Stephane Laurent, VP Sales & Marketing and co-founder.
Evaluation kits have been sampled to lead customer in India and Korea and starting end of Q3 2017 for general customers.
For more information, see http://www.gridbeecom.com
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- IP Cores, Inc. Announces three low-latency Fast Fourier Transform IP cores for SoC applications in the OFDM-based communications (WiMAX, MBOA, IEEE 802.11) and GPS fields
- BOS and Tenstorrent Unveil Eagle-N, Industry’s First Automotive AI Accelerator Chiplet SoC
- Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
- SiWorks Inc. Announces FFT and Viterbi Cores For The Emerging IEEE 802.15.3a Multi-band OFDM UWB Standard
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology