Foxconn Reportedly Readies Chip Fab in China
By Dylan McGrath, EETimes
December 27, 2018
SAN FRANCISCO — Taiwan's Hon Hai Precision is set to break ground in 2020 on a $9 billion 300mm chip fab in the city of Zhuhai in southern China, according to a report by the Nikkei news service.
Hon Hai, which operates under the trade name Foxconn, has been mulling plans since early this year to build and operate its own semiconductor fab to make chips for the products it builds for other firms on a contract manufacturing basis. In August, the Wall Street Journal reported that Foxconn inked a deal with Zhuhai's government to locate its first chip fab there.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- China Bets on Homegrown Chip Tech With RISC-V Push
- RISC-V Solidifies Presence in China as Global Momentum Builds
Latest News
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI
- QuickLogic Announces $13 Million Contract Award for its Strategic Radiation Hardened Program