Foxconn Reportedly Readies Chip Fab in China
By Dylan McGrath, EETimes
December 27, 2018
SAN FRANCISCO — Taiwan's Hon Hai Precision is set to break ground in 2020 on a $9 billion 300mm chip fab in the city of Zhuhai in southern China, according to a report by the Nikkei news service.
Hon Hai, which operates under the trade name Foxconn, has been mulling plans since early this year to build and operate its own semiconductor fab to make chips for the products it builds for other firms on a contract manufacturing basis. In August, the Wall Street Journal reported that Foxconn inked a deal with Zhuhai's government to locate its first chip fab there.
To read the full article, click here
Related Semiconductor IP
- Very Low Latency BCH Codec
- 5G-NTN Modem IP for Satellite User Terminals
- 400G UDP/IP Hardware Protocol Stack
- AXI-S Protocol Layer for UCIe
- HBM4E Controller IP
Related News
- Exec tried to set up copy-cat Samsung fab in China
- Korean prosecutors name ex-Samsung exec who tried to set up copy-cat fab in China and the Taiwanese backer
- China Bets on Homegrown Chip Tech With RISC-V Push
- China Unyielding Ascent in RISC-V
Latest News
- CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
- Synopsys Introduces Software-Defined Hardware-Assisted Verification to Enable AI Proliferation
- AimFuture and ITM Semiconductor to Develop AI-Integrated Technology for Robotics and Mobility
- TSMC February 2026 Revenue Report
- Silvaco Announces Immediate Availability of Production Ready Mixel MIPI PHY IP, Strengthening its Comprehensive Silicon IP Offering