China IC 'Big Fund' Phase II Aims Self-Sufficiency
By Luffy Liu, EETimes
October 30, 2019
Compared to its Phase I that began five years ago, Big Fund Phase II is twice as big at 204.15 billion yuan ($28.9 billion), slightly exceeding market expectations. Phase II investment is anticipated to start as early as November this year.
The Big Fund first phase, which invested in 23 semiconductor companies, resulted in multiple mergers, acquisitions and IPOs.
To read the full article, click here
Related Semiconductor IP
- DeWarp IP
- 6-bit, 12 GSPS Flash ADC - GlobalFoundries 22nm
- LunaNet AFS LDPC Encoder and Decoder IP Core
- ReRAM NVM in DB HiTek 130nm BCD
- UFS 5.0 Host Controller IP
Related News
- Cadence Selected by Microsoft for RAMP Phase II Program
- China-Based IC Production to Represent 21.2% of China IC Market in 2026
- Denying China IC Manufacturing Tools
- The Five Biggest MCU Suppliers Accounted for 82% of 2021 Sales
Latest News
- Hardware Root of Trust Essential for AI Chip Integrity
- AI Compute Demand Drives 44% YoY Growth for Top 10 Global Fabless IC Firms in 2025
- IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
- Rambus Unveils HBM4E Controller: 16 GT/s, 2,048-Bit Interface, Enabling C-HBM4E
- AimFuture, a Leader in Home Appliance NPUs, to Integrate Mesacure Company’s AI Algorithms