Chelsio Communications Licenses Tensilica's Xtensa LX Customizable Dataplane Processor Core for 10 Gigabit Ethernet
SANTA CLARA, CA-- July 20, 2010 -- Tensilica,® Inc. today announced that Chelsio Communications, Inc., of Sunnyvale, Calif., has licensed the Xtensa LX customizable DPU (dataplane processor) for its next-generation 10Gb Ethernet Terminator ASIC (application specific integrated circuit). Chelsio has used Tensilica's Xtensa DPUs in two previous generations of Terminator ASICs.
Tensilica DPUs in Networking and Data Center Applications
Tensilica's DPUs have long been key ingredients in many network infrastructure applications and network access devices. A combination of Xtensa DPU features -- including the ability to customize interfaces and signal processing for high-performance and low-power optimization -- make the Xtensa DPU cores an optimal fit for the compute intensive functions found in high-speed networks.
About Chelsio Communications, Inc.
Chelsio Communications is leading the convergence of networking, storage and clustering interconnects with its robust, high-performance and proven unified wire, storage software and appliance technology. Featuring a highly scalable and programmable architecture, Chelsio is shipping 10-Gigabit Ethernet and multi-port Gigabit Ethernet adapter cards, delivering the low latency and superior throughput required for high-performance computing applications. For more information, visit the company online at www.chelsio.com.
About Tensilica
Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Related Semiconductor IP
- Rad-Hard GPIO, ODIO & LVDS in SkyWater 90nm
- 1.22V/1uA Reference voltage and current source
- 1.2V SLVS Transceiver in UMC 110nm
- UALink PCS IP Core
- 1.8V/3.3V GPIO With I2C Compliant ODIO in GF 55nm
Related News
- Ikanos Selects Virage Logic as Trusted IP Partner, Inks Three-Year Full Access Deal
- WI-LAN Announces $30 Million Bought Deal Financing
- PLDA and AGFA Graphics Sign Silica-Brokered Deal
- Wi-LAN Completes Closing of $30 Million Bought Deal Financing
Latest News
- Quintauris and TASKING Partner to Join Forces to Power RISC-V in Automotive
- 2Q25 Foundry Revenue Surges 14.6% to Record High, TSMC’s Market Share Hits 70%
- EXTOLL received GlobalFoundries Award for “Interface IP Partner of the Year”
- AiM Future and Franklin Wireless Sign MOU to Jointly Develop Lightweight AI Model and High-Efficiency 1 TOPS AI SoC Chipset
- GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity