Apple, HTC patent deal seen as first of many
Rick Merritt, EETimes
11/12/2012 8:49 PM EST
SAN JOSE, Calif. – The licensing deal between Apple and Taiwan’s HTC will be the first of many to come, according to patent watchers who see the deal as a turning point in a two-and-a-half-year mobile war.
Apple announced on Nov. 10 it reached “a global settlement that includes the dismissal of all current lawsuits and a ten-year license agreement” with HTC, although it declined to provide details of the deal. Apple sued HTC for patent infringement on March 2, 2010, firing the first shot in a mobile patent war that eventually grew to more than 100 lawsuits and countersuits.
To read the full article, click here
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
- P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
Related News
- Apple, HTC patent deal may not open Android door
- Intel to Cut A Deal with Apple for Fab 42?
- Apple Seen Splitting 14/16nm Orders Among Foundries into 2016
- Jury Awards Core Wireless $7.3 Million in Patent Litigation Against Apple
Latest News
- Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure
- Arteris Announces Financial Results for the Third Quarter and Estimated Fourth Quarter and Updated Full Year 2025 Guidance
- CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores
- Kerala Positions Design and IP at Core of Chip Strategy
- GUC Monthly Sales Report – October 2025