Via-PUF Security Chip for Root of Trust

Overview

ICTK's Via-PUF solutions let you build the most reliable root of trust for IoT supply chain safety.

Via-PUF Root of Trust SoCs are mass production-proven with huge quantitiy of supply to global major IT customers.

Via-PUF is highly stable against PVT variance (process, voltage, temperature), so it provides great reliabilty and stablitiy without any additional error correction code. (We don't use ECC - error correction)

For more information please contact ghjin@ictk.com

Key Features

  • Device authentication by sym. and asym. cryptography.
  • Firmware protection
  • Data encryption
  • Anti-counterfeiting
  • Secure Storage
  • OTA and FOTA

Benefits

  • VIA-PUF RoT Chip provides the highest security level to your IoT devices and network by providing PUF-based H/W Root of Trust.
  • VIA PUF RoT SoCs are highly reliable supporting JEDEC standard reliablity as well as AEC-Q100.

Block Diagram

Via-PUF Security Chip for Root of Trust Block Diagram

Applications

  • Any IoT devices / network equipment that need security and authentication

Deliverables

  • PUF security SoC, the H/W Root of Trust for IoT edge devices
  • PUF-powered security Modules
  • PUF-powered security USB keys
  • PUF-powered FIDO key
  • PUF-powered security VPN
  • PUF-powered USIM and eSIM
  • PUF with PQC
  • FOTA and Key management system

Technical Specifications

Foundry, Node
130nm, 110nm, 100nm, 65nm, 28nm
Maturity
Silicon Proven
Availability
Now
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Semiconductor IP