Simulation VIP for LPDDR5

Overview

In production since 2015 on dozens of production designs.

This Cadence® Verification IP (VIP) supports the JEDEC® Low-Power Memory Device, LPDDR5 standard. It provides a mature, highly capable compliance verification solution that supports simulation, formal analysis, and hardware acceleration platforms, making it applicable to intellectual property (IP), system-on-chip (SoC), and system-level verification. The VIP for LPDDR5 is compatible with the industry-standard Universal Verification Methodology (UVM), runs on all leading simulators, and leverages the industry-standard Cadence Memory Model core architecture, interface, and use model.

The LPDDR5 standard is an industry-leading low-power volatile (DRAM) device memory standard for storage of system code, software applications, and user data. The LPDDR5 Low-Power Memory Device Standard is designed to satisfy the performance and memory density demands of the latest generation of mobile devices such as smartphones, tablets, ultra-thin notebooks, and similar connected devices on the newest, high-speed 4G networks.

Supported specification: The VIP for LPDDR5 Memory Model supports the latest proposals which are balloted at JEDEC for LPDDR5 and LPDDR5x and the specifications: JESD209-5A and JC-42.6-1854.99A dated 2019/10/04.

Key Features

  • Speed
    • 1066.5MHz (8533 Mbps)
  • Device Density
    • Supports a wide range of device densities from 2Gb to 32Gb
  • Bank Architecture
    • 8B, 16B, and 4BankGroup
  • General DDR Functionality
    • Activation, Precharge, and Mode Register Write and Read, CAS, Mask Write, Read, Write, Mask Write, Power Down, Refresh, Self Refresh, and DSM command and related timing checks
    • Initialization Sequence
    • Bus timing: Setup/Hold Per Lane or Per Bit, Pulse width
    • Clock frequency change and clock stop and related checkers.
    • RDQS timing support
    • VREF Current Generator (VRCG)
    • Differential Clock (CK, WCK) checks
    • Duty Cycle Monitor (DCM)
    • Temperature Derating
    • tHZDQ, tHZDQS
    • Core timing table when Link ECC is enabled
    • User configurable timing parameters to corrupt data eye during read path
  • Training Modes
    • Enhanced RDQS training mode
    • Read DQ Calibration
    • Write Leveling
    • Command Bus Training Mode1 and Mode2
    • WCK2DQoscillator
    • RDQS toggle mode
    • Read FIFO and Write FIFO
    • Link ECC WCK-RDQS_t/Parity Training using FIFO
    • Vref CA and DQ training
    • Read/Write based WCK-RDQS_t Training
  • Write Clock
    • WCK2Ck synchronization
    • 4:1 and 2:1 WCK to CK ratio
    • WCK Sync off timing
    • WCK2DQ AC timings for low and high frequency
    • Enhanced WCK always On
    • Write clock-related timing parameter support - tWCH, tWCL, tWCK(avg), and tJIT
    • WCK suspend mode - tWCKSUS
  • Low Power Consumption Features
    • Read and Write Datacopy
    • Write-X
    • WXS, WXSA, and WXSB support (byte controllable writex)
  • Configurable Preamble and Postamble
    • Allows preamble and postamble to be configured for Read, Write, and Mask Write
  • Data Bus Inversion
    • Data on the bus can be inverted during both read and write to save power
  • Frequency Set Points
    • Allows LPDDR5 to be switched between three different operating frequencies by duplicating mode register parameters commonly changed with operating frequency
  • Exploration Mode
    • VIP acts as a passive monitor without driving data and only checks for the command protocols: Read, MRR, Write, and Mask Write
  • MPC
    • Supports all 6 MPC commands
  • Command Bus Training
    • The training centers the internal VREF(ca) in the CA data eye and, at the same time, allows timing adjustments of the CS and CA signals to meet setup and hold requirements
  • Latency Code Frequency Table
    • Checks all read and write latency requirements for a given frequency
  • Tccd+n Reads and Writes
    • All combinations of Reads merging and Writes merging placed Tccd+n apart
  • Delay Modeling
    • Delay modeling of input and output signals, display of delay modeling internal signals on the simulator waveform
  • Single-Ended Clock
    • Single-Ended Clock, Write Clock, and RDQS support
  • Byte Mode
    • Support for Byte Mode (x8) devices
  • Refresh
    • Refresh rates and options to control the application of new rates
  • Temperature Derating
    • Support for temperature derating and per-timing derating factor
  • Link-ECC
    • Support for Write and Read Link Error Correcting Code
  • DMI Pin Behavior
    • DMI Pin behavior based on Read/Write-related commands
  • ODT
    • Support for On Die Termination on timings, which is command-to-command timing checks with ODT enabled, tODTup, tDQ7FSP
  • ZQ Calibration
    • Support for command based and background ZQ calibration
  • Skew Support
    • Support for adding skew on RDQS using tDQSQ
    • Support for adding skew on bytelane during Write using tWCKDQISkew
  • Duty Cycle Adjuster
    • Support for controlling the duty cycle of RDQS/DQ during Reads
  • RDQS Glitch Modeling
    • Ability to add glitches on RDQS
  • Rank to Rank Timing Checks
    • Support for rank2rank timing checks using LPDDR5MDP
    • Support includes all the Rank-to-Rank timing constraints available in JESD209-5A spec
  • Refresh Management
    • Support for Refresh Management functionality
  • Monitor Mode
    • In this mode, the DRAM will perform complete protocol validation. However, the DRAM will not drive (output) any data on I/O pins.
  • DFE
    • Support for Decision Feedback Equalization includes: Rank to rank timing constraints affected with enabling DFE and tDPRE pre-drive requirement before the write data burst operation
  • Functional Coverage
    • Provides a rich functional coverage of the model
    • Inter-rank timing checks coverage is provided withLPDDR5MDP
  • Delay Randomization
    • Support for delay randomization on WCKDQO with drifts
  • PPR
    • Support Post Package Repair functionality

    Block Diagram

    Simulation VIP for LPDDR5 Block Diagram

    Technical Specifications

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