Certus Semiconductor has a long history of working across a broad range of technology nodes from 180nm down to the latest FinFet offerings. Our I/O solutions include 1.8V & 3.3V GPIO, I2C, SMBUS, open-drain, RGMII, SD, LVDS, HDMI and more.
Drawing from this rich database, Certus has a starting point from which we can create any custom additions you may need. Our building-block design style also enables us to configure our IOs to fit a variety of cell sizes, aspect ratios, pad arrangements and packages. We work closely with our clients to provide tailored solutions affordably and with fast turnaround.
Built into our IO libraries, and also offered as a separate service, is our strong ESD expertise. Certus was founded by ESD engineers and our results speak for themselves. Not only do we address standard ESD such as HBM and CDM, but we can also provide on-chip solutions for standards such as IEC-61000-4-2, system-level ESD and Cable Discharge Events (CDE).
IO & ESD solutions supporting GPIO, I2C,RGMII, SD, LVDS, HDMI & analog/RF across multiple technology nodes
Overview
Key Features
- Certus offers dedicated 1.8V, 3.3V and switchable 1.8V/3.3V General-Purpose IO (GPIO) solutions.
- GPIO features include:
- Dedicated 1.8V & 3.3V cells or dynamically switchable 1.8V/3.3V cell
- Multiple drive strengths (dedicated cells or selectable)
- Supply sequence independence
- Output enable / disable (HiZ when disabled)
- Schmitt trigger input
- Selectable pull-up or pull-down resistor
- Flexible metal stack and cell pitch variations
- Wirebond & Flip-Chip support
- I2C / SMBUS Open-Drain I/O features include:
- Up to 5V external supply support
- Hysteresis input
- Power sequence independence
- External resistor support of 1K-50K Ohm
- Fail-safe protection
- 2KV HBM, 500V CDM
- Also DDC, CEC and HPD compliant
- LVDS I/O features include:
- Output enable (TX)
- Input enable (RX)
- Internally generated common mode reference (no external pin required)
- Built-in 100? RX termination resistor
- Fault-safe mode for shorted or open RX pins
- Power-on sequence independence
- ESD protection of 2KV HBM, 500V CDM
Benefits
- High confidence level for first time-right IC ESD design backed by SPICE simulation, optimization and verification methodology including HBM & CDM specifications
- Highly area-efficient solutions allowing for IO height reductions of typically > 20% compared to standard foundry IOs
- Portable & foundry proven
- Si product proven IP in most advanced CMOS from 180nm down to 12nm
- Uniform ESD protection levels with more effective CDM protection
- Standard, full custom libraries plus IO template library offering
- Fast turnaround custom IO library designs
Block Diagram
Deliverables
- GDS
- CDL netlist
- Verilog stub
- Verilog behavioral model
- LEF
- Liberty Timing Files
- IBIS (option)
- Electrical datasheet
- User guide and application notes
- Consulting and Support
Technical Specifications
Foundry, Node
TSMC 180nm, 130nm, 65nm, 28nm, 22nm, 16nm & 12 nm
Maturity
Silicon-Proven
TSMC
In Production:
12nm
,
16nm
,
22nm
,
28nm
HPCP
,
28nm
HPM
,
65nm
G
,
65nm
GP
,
65nm
LP
,
130nm
G
,
130nm
LP
,
130nm
LV
,
130nm
LVOD
,
180nm
G
,
180nm
LP
,
180nm
LV
Related IPs
- 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options
- LVDS RX & TX IOs in multiple foundry technology
- Voltage reference with multiple output voltages (0.4V to 0.9V) for 3.6V supply, voltage reference sampling capacitor designed in 0.18um 6M TSMC technology.
- A 130nm Wirebond IO library with 3.3V GPIO, LVDS TX & RX, 3.3V I2C open-drain, analog cell and OTP program cell
- A 180nm Flip-Chip IO library with 1.2-1.8V GPIO, 1.8V & 5V analog/RF, 20-36V ultra-low leakage low-cap HV analog and OTP program cell
- A 65nm Wirebond IO library with 2.5V GPIO, LVDS TX & RX and 2.5V analog / RF