I3C

Overview

The’s I3C (Improved Inter Integrated Circuit) is enhanced with I2C protocol and is compatible with I2C. It adds new functions, including higher transmission speed, in-band interrupt, CRC check, and so on. Now, the I3C protocol is divided into MIPI and JEDEC. Usually, MIPI I3C is applied in sensor/IoT data transmission, and JEDEC I3C is applied in storage chip configuration.

The I3C IP supports I3C master/slave functions, compliant with JESD403-1B and MIPI I3C. Users read and write the internal registers through the APB3.0 interface, and DMA is also supported for the internal data buffer write or read. I3C Master converts the parallel data, which are configured by the users, into SDL/SDA serial data. At the same time, I3C Slave converts the data of register reading and writing into SCL/SDA.

Key Features

  • Supports two-wire serial interfaces: SDA/SCL
  • Supports primary master/slave only or dynamic configuration
  • Supports secondary master
  • Compliant with JESD403-1B and MIPI_I3C_Specification_V1.0
  • Supports independent data and command buffers, configurable in-depth
  • Supports working as the master device, providing a special buffer to obtain the device's characteristic information
  • Supports single command 65536 write/read bytes
  • Supports in-band interrupt with or without data
  • Backward compatible with I2C
  • Supports SCL frequencies up to 12.5MHz in I3C mode
  • Supports CRC/Parity check
  • Supports mixed fast bus for lower effective rate
  • Supports broadcast and directed CCC transfer
  • Supports private write and read
  • Supports interrupt interface, used to report the interrupt to the software
  • Supports DMA handshaking interface or internal DMA for data buffer
  • Supports APB3.0/4.0 for configuration and AHB/AXI interface for IP internal DMA
  • The configuration clock and core clock can be synchronous or asynchronous

Benefits

  • High speed
  • High efficiency
  • High reliability
  • Low power consumption

Block Diagram

I3C Block Diagram

Deliverables

GDSII Layout and layer map for foundry merge

Place and Route LIB and LEF views for the AFE

LVS and DRC verification reports

  • Databook
  • Integration Guidelines
  • Soft driver design Guidelines
  • Frontend simulation environment and reports/Guidelines
  • If customers expect us to provide Backend and Layout service, the following additional deliverables will be included:

Technical Specifications

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Semiconductor IP