General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
Overview
UMC 0.13um Logic HS/RVT FSG process true 3.3V Generic IO cell for BOAC.
Technical Specifications
Short description
General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
Vendor
Vendor Name
Foundry, Node
UMC 130nm HS/FSG
UMC
Pre-Silicon:
130nm
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