Specialty PECL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
Overview
UMC 0.13um HS/FSG Logic process 3.3V PECL IO with POC (Pad On Circuit).
Technical Specifications
Short description
Specialty PECL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
Vendor
Vendor Name
Foundry, Node
UMC 130nm HS/FSG
UMC
Pre-Silicon:
130nm
Related IPs
- Specialty PCI IO IP, BOAC (Bonding Over Active Circuit), 5V tolerance, UMC 0.13um HS/FSG process
- Specialty SSTL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
- Specialty SSTL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
- Specialty OSC IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
- Specialty OSC IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
- Specialty PCI IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process