An optimum deployment of DCI in a Chipletized system would implement full DCI interfaces on all Chiplets. To this end, CrossFire will be offering DCI in most flavors of TSMC silicon at 7nm and below.
If necessary, DCI can also be utilized in a multi-Chiplet system with limited DCI connectivity by working directly with CrossFire to optimize the other Chiplets via CrossFire’s proprietary post fab die processing capabilities to mostly achieve the lower power and improved performance characteristics of fully DCI connected systems
CrossFire will also consider working with a customer / standards body for a custom implementations of DCI - for example:
- To reduce the power and die area of the proprietary interface of an Integratred Device Manufacter (IDM) or Fabless Semiconductor Company.
- To enable the use of standard “on-chip” fabrid interfaces such as CHI or VCIX in Chipletized environments.
- Improving the performance metrics of a standard off-chip interface such as CXL in a Chipletized environment