Camera Combo Receiver - 2.4Gbps 8-Lane - TSMC 28nm HPC

Overview

The CL12842M8R2JM4TIP2500 is an ideal means to link Camera Modules or CMOS Image Sensor (CIS) to ISP (Imaging Signal Processer) and DSP.

The CL12842M8R2JM4TIP2500 is designed to support data rate in excess of maximum 2.5Gbps utilizing SLVS-EC / sub-LVDS / MIPI D-PHY v-1.2/ CMOS 1.8V interface specification. The CL12842M8R2JM4TIP2500 can change Interface type to same PAD for changing mode.

Key Features

  • SLVS-EC ver.1.2 / MIPI D-PHY ver.1-2 compliant
  • Supporting for four kind Differential Input Signals
    • 1) SLVS-EC (Maximum 2.4Gbps)
    • 2) sub-LVDS (Maximum 800Mbps)
    • 3) MIPI D-PHY (Maximum 2.5Gbps)
    • 4) CMOS 1.8V (Maximum 166MHz)
  • Xtal Input Clock Frequency Selectable 24MHz / 37.125MHz / 54MHz / 72MHz
  • Maximum Input Clock Frequency ~1.25GHz, Maximum Input Data Transfer Rate ~2.5Gbps
  • Maximum Output Clock Frequency ~312.5MHz
  • Power Supply : Vcc=1.8V (IO and Analog) Vdd=0.9 V (Inside Core)
  • Maximum Lane Number : 8-Lane
  • 10-bit/Lane Parallel Outputs (SLVS-EC)
    • 8-bit/Lane Parallel Outputs (sub-LVDS Serial / MIPI D-PHY)
    • 1-bit/Lane Parallel Outputs (sub-LVDS Parallel)
  • Including Power Down Mode
  • Including "Hi-Z" Detect Circuit for SLVS-EC
  • TSMC 28nm HPC Process 1P10M5X2R (Using of Standard Vth Transistor)
  • Poly Direction: South-North
  • Various process porting support available ( Please contact us. )
  • Supporting Link-layer: CD12842M8LRM3BM4AIP312P5(SLVS-EC/LVDS, CSI2 Combo) soft macro

Technical Specifications

Foundry, Node
TSMC 28nm HPC
Maturity
Silicon Proven
Availability
Now
TSMC
Silicon Proven: 28nm HPC
×
Semiconductor IP