AXI Fabric Package for Scalable SoC Applications
Overview
AndeShape AE300 package in this document refers to two licensable Andes platform products, the AE300FB AXI fabric and the AE300EP example platform. The AE300FB AXI fabric package includes AXI interconnect IP components only. Those highly configurable and scalable components can be easily integrated to construct an AXI fabric with optimized performance-area results. The AE300EP example platform package provides a pre-integrated AXI example platform consisting of AE300FB IPs as well as additional peripheral IPs. This example platform enables fast deployment of complete AXI-based systems with peripheral devices.
Key Features
- AE300FB – AXI Fabric
- AXI bus matrix
- Compliant with AMBA AXI4
- Configurable connectivity between masters and slaves
- 3 programmable priority levels with round-robin arbitration
- AXI interconnect
- Supports AMBA AXI4/AHB/AHB-Lite
- AE300EP – Example Platform
- AXI bus matrix
- 32-bit address and 64-bit data width
- AHB/APB bus interconnect
- 32-bit address and 32-bit data width
- APB peripherals: GPIO, PIT, SPI, UART, WDT
- Supported AndesCore processors: N968A/N1068A/D1088/N1337/N15/N15F/D15/D15F(Separately Licensable)
- The AE300EP enables users to build high-flexibility, low-cost, and fast time-to-market AXI systems.
- AXI Fabric Package for Scalable SoC Applications
Benefits
Block Diagram
Applications
Technical Specifications
Related IPs
- Highly powerful and scalable multi-mode communication processor for IoT wireless applications
- Multifunctional DSP Architecture for High-Performance, Low-Power Audio/Voice/Sensing and Wireless Communication Applications
- High-performance Processor for Real-time and Linux Applications
- Scalable multicore architecture for a range of macrocells, small cells, cloud-RAN, DFE/DPD/ and more
- AXI bus fabric (AXI Master and Slaves)
- AXI Interconnect Fabric