新思科技 DesignWare IP基于台积公司 N5制程技术助力客户连续实现一次流片成功,获行业广泛采用
æ°æç§æé«è´¨éæ¥å£ååºç¡IPæ ¸è·å¾20å¤å®¶é¢å å导ä½å ¬å¸çéç¨ï¼æ¶µç汽车ãç§»å¨å髿§è½è®¡ç®å¸åº
å å©ç¦å°¼äºå·å±±æ¯å2021å¹´6æ29æ¥ -- æ°æç§æï¼Synopsys, Inc., 纳æ¯è¾¾å è¡ç¥¨ä»£ç ï¼SNPSï¼è¿æ¥å®£å¸ï¼å ¶å¹¿æ³çDesignWare®æ¥å£ãé»è¾åºãåµå ¥å¼åå¨å¨åPVTçæ§IPæ ¸è§£å³æ¹æ¡åå©20å¤å®¶é¢å å导ä½å ¬å¸å¨å°ç§¯å ¬å¸N5å¶ç¨ä¸å®ç°ä¸æ¬¡æ§æµçæåãè¿äºå®¢æ·éæ©DesignWare IPæ ¸è§£å³æ¹æ¡ï¼ä»¥æ»¡è¶³é¢åå è¿æ±½è½¦é«çº§è¾ å©é©¾é©¶ç³»ç» (ADAS, Advanced Driver Assistant System)åä¿¡æ¯å¨±ä¹ãAIå éå¨ãæå¡å¨ãç½ç»åç§»å¨çç³»ç»çº§è¯ç (SoC) 设计æéçä¸¥æ ¼åèãæ§è½åé¢ç§¯ï¼PPAï¼è¦æ±ãæ°æç§æDesignWare IPæ ¸åVCéªè¯IPæ ¸è·å¾å¹¿æ³éç¨å¹¶åå©ä¼å¤å®¢æ·å®ç°è¯çæåï¼ç»å¼åè 带æ¥å 足信å¿ï¼ä½¿å ¶æ¾å¿éæè¯¥IPæ ¸ï¼å¹¶å¯æ¾èéä½SoCçéæé£é©ã
å°ç§¯å ¬å¸è®¾è®¡åºç¡è®¾æ½ç®¡çäºä¸é¨å¯æ»ç»çSuk Lee表示3å°ç§¯å ¬å¸ä¸æ°æç§æé¿æå¯ååä½ï¼è®©æä»¬çå ±å客æ·è½å¤åçäºå°ç§¯å ¬å¸å è¿å¶ç¨ææ¯åæ°æç§æçç广æ³é«è´¨éIPæ ¸ç»åç强强èåãæ°æç§æé¢åå°ç§¯å ¬å¸N5å¶ç¨çDesignWare IPæ ¸æ¯ä¼äºåç±»çå è¿æ¶ååè§£å³æ¹æ¡ï¼å¯åå©å¼åè å®ç°çæ³PPAãå¿«é交ä»å·®å¼å产åå¹¶å®ç°é产ï¼åæ¶è·å¾N5å è¿å¶ç¨æå¸¦æ¥çå ¨é¨ä¼å¿ã”
æ°æç§æIPæ ¸è¥éåæç¥é«çº§å¯æ»è£John Koeter表示3æ°åå¹´æ¥ï¼æ°æç§æä¸ç´ä¸å°ç§¯å ¬å¸éååä½ï¼æä¾åè½ä¸°å¯çç¡ éªè¯IPæ ¸ï¼åå©å¼åè éç¨å°ç§¯å ¬å¸N5åN3çå è¿å¶ç¨ææ¯ä»¥æ»¡è¶³æ±½è½¦ã髿§è½è®¡ç®åAI设计çåºç¨çæ°æ®å¯éåéæ±ãä¼å¤å®¢æ·å¨å°ç§¯å ¬å¸N5å¶ç¨ä¸å¹¿æ³éç¨æ°æç§æçDesignWare IPæ ¸ç»åï¼å åå½°æ¾äºå®¢æ·å¯¹æ°æç§æIPæ ¸çæç»ä¿¡ä»»ï¼è½å¤åå©ä»ä»¬é使´åé£é©å¹¶å éå°äº§åæ¨åå¸åºã”
æ°æç§æå¹¿æ³çDesignWare IPæ ¸ç»åå æ¬é»è¾åºãåµå ¥å¼åå¨å¨ãIOãPVTçè§å¨ãåµå ¥å¼æµè¯ã模æIPãæ¥å£IPãå®å ¨IPãåµå ¥å¼å¤çå¨ååç³»ç»ã为å éåå设计ã软件å¼å以åå°IPæ ¸æ´åè¿è¯çï¼æ°æç§æIP Accelerated计åæä¾IPåå设计å¥ä»¶ãIP软件å¼åå¥ä»¶åIPæ ¸åç³»ç»ãæä»¬å¯¹IPè´¨éçå¹¿æ³æèµãå ¨é¢çææ¯æ¯æå¯ä½¿å¼åè é使´åé£é©ï¼å¹¶å å¿«ä¸å¸æ¶é´ãäºè§£æ´å¤ä¿¡æ¯ï¼è¯·è®¿é®https://www.synopsys.com/designwareã
ä¾è´§æ åµåèµæº
- ç®å坿ä¾ä»¥ä¸é¢åå°ç§¯å ¬å¸N5å¶ç¨çDesignWare IPæ ¸ï¼eUSB2ãUSB 2.0ãUSB 3.1ãUSB-C 3.1ãUSB-C 3.1/DPãPCIe 3.0/5.0ã112G EthernetãHBI Die-to-DieãLPDDR5/4/4XãDDR5/4ãHBM2EãMIPI C-PHY/D-PHYãMulti-Protocol 32G PHYãé»è¾åºãåµå ¥å¼åå¨å¨ãçå ä¼ æåPVTçæ§
- 2021å¹´ä¸å年坿ä¾ä»¥ä¸é¢åå°ç§¯å ¬å¸N5å¶ç¨çDesignWare IPæ ¸ï¼USB-C 3.2ãUSB 4.0ãPCIe 4.0ã112G USR/XSR Die-to-DieãMulti-Protocol 16G PHYãHDMI 2.1ãDisplayPortãMIPI M-PHY
- æå ³æ´å¤ä¿¡æ¯ï¼è¯·è®¿é®DesignWare IPæ ¸ç»åã
å ³äºæ°æç§æ
æ°æç§æï¼Synopsys, Inc., 纳æ¯è¾¾å è¡ç¥¨ä»£ç ï¼SNPSï¼æ¯ä¼å¤åæ°åå ¬å¸çSilicon to Software™ï¼“è¯çå°è½¯ä»¶”ï¼åä½ä¼ä¼´ï¼è¿äºå ¬å¸è´åäºå¼åæä»¬æ¥å¸¸æä¾èµççµå产åå软件åºç¨ãä½ä¸ºä¸å®¶æ æ®500å¼ºå ¬å¸ï¼æ°æç§æé¿æä»¥æ¥ä¸ç´æ¯çµå设计èªå¨åï¼EDAï¼åå导ä½IPé¢åçå ¨çé¢å¯¼è ï¼å¹¶æä¾ä¸çæå¹¿æ³çåºç¨å®å ¨æµè¯å·¥å ·åæå¡ç»åãæ è®ºæ¨æ¯å建å è¿å导ä½ççä¸ç³»ç»ï¼SoCï¼System of Chipï¼è®¾è®¡äººåï¼è¿æ¯ç¼åæ´å®å ¨ãæ´ä¼è´¨ä»£ç ç软件å¼å人åï¼æ°æç§æé½è½å¤æä¾æ¨çåæ°äº§åæéè¦çè§£å³æ¹æ¡ãäºè§£æ´å¤ä¿¡æ¯ï¼è¯·è®¿é®www.synopsys.comã
Related Semiconductor IP
- USB4 Gen3 x2-lane PHY, TSMC N5, 1.2V, N/S orientation, type-C
- USB 2.0 femtoPHY - TSMC N5 12 x1, North/South (vertical) poly orientation
- eUSB 2.0 PHY - TSMC N5 x1, North/South (vertical) poly orientation
- USB-C 3.2 DP/TX PHY ebdaux for TSMC N5, North/South poly orientation
- USB-C 3.1 SS/SSP PHY, Type-C - TSMC N5, North/South Poly Orientation
Related News
- 新思科技IP 组合在台积公司3纳米工艺上实现首次流片成功,加速先进芯片设计
- 新思科技助力Achronix新一代应用于数据和人工智能加速的FPGA首次通过硅验证
- Cadence 在 TSMC N5 工艺上展示 PCI Express 6.0 规范的 IP 测试芯片
- 新思科技推出面向台积公司N6RF工艺的全新射频设计流程,助力提升5G SoC 开发效率