Rambus发布基于三星LPP制程的串行链路物理层

Comprehensive IP solution enables high performance for networking and data center applications

SUNNYVALE, Calif. – January 19, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced the availability of a 28Gbps multi-modal serial link PHY on Samsung’s leading-edge 14nm Low Power Plus (LPP) process. The R+ 28G Serial Link PHY is a 100 Gigabit Ethernet solution that is optimized for power and area efficiency in long-reach channels. It enhances the Rambus suite of high-speed memory and serial link interfaces.

“The increasing demand for more data at increasing speeds continues to drive the bandwidth requirements in enterprise applications,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. “We are pleased Samsung has selected us to work in their advanced 14nm LPP process, enabling our solutions to achieve the tremendous speeds and power efficiencies required by today’s high-performance systems.”

The Rambus R+ 28G Multi-protocol Serial Links PHY delivers enterprise-class performance across the challenging signaling environments typical of networking and server systems with features including:

• High-performance and multi-protocol compatibility with support for data rates from 1.25Gbps to 28.1Gbps across copper and backplane channels with up to 30dB loss in a wide range of industry-standard interconnect protocols.
• Application-specific optimization enabled by an efficient and scalable architecture with adaptive and programmable receive equalization, and support for transmit FIR adaptation.
• Ease-of-integration and bring-up featuring built-in-self-test (BIST) with PRBS generator and checker, in-situ real-time monitoring and support for LabStation™ Validation Platform.

Rambus’ R+ industry-standard interface solutions are high-quality, complete PHY solutions designed with a system-oriented approach, maximizing flexibility in today’s most challenging system environments. For additional information, please visit rambus.com/seriallinks.

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.