TSMC 12FFC IP
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109
IP
from 8 vendors
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10)
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DDR4/ LPDDR4/ DDR3L PHY IP - 3200Mbps (Silicon Proven in TSMC 12FFC)
- Supported DRAM type: DDR3L/DDR4/LPDDR4
- Maximum controller clock frequency of 400MHz resulting in maximum DRAM data rate of 1866Mbps
- Interface: SSTL135/POD12/LVSTL
- Data path width scales in 32-bit increment
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512x8 Bits OTP (One-Time Programmable) IP, TSMC 12FFC 0.8V/1.8V Process
- Fully compatible with TSMC 12FFC 0.8V/1.8V
- Low voltage: 0.8 V ± 10% for read and 1.1 V ± 5% for program
- High speed: 10µs program time per bit, and 50ns read 8-bit at a time
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USB-C 3.1/DP TX PHY for TSMC 12FFC, North/South Poly Orientation
- Industry’s only USB Type-C IP solution consisting of USB-C 3.1/DisplayPort 1.3 Tx PHYs, USB-C 3.1/DisplayPort 1.3 Tx controllers with HDCP 2.2 and HDCP 1.4 content protection, verification IP, IP subsystems, IP prototyping kits, and IP software development kits
- Solution supports USB Type-C, SuperSpeed USB 3.1 at 10 Gbps, SuperSpeed USB 3.0 at 5 Gbps and High-Speed USB (USB 2.0) as well as DisplayPort 1.3 Tx supporting RBR, HBR1, HBR2 and HBR3 bitrates
- Controllers support Device, Host, and Dual-Role Device USB-C 3.1 as well as DisplayPort 1.3 Tx with HDCP 2.2 content protection
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DisplayPort 1.4 TX PHY, TSMC 12FFC, North/South Poly Orientation
- USB-IF certified DesignWare USB 3.1 solution
- VESA certified DesignWare DisplayPort 1.4 Tx solution
- Industry’s only USB Type-C IP solution consisting of USB-C 3.1/DisplayPort 1.4 TX PHYs, USB-C 3.1/DisplayPort 1.4 TX controllers with HDCP 2.2 and HDCP 2.2 content protection, verification IP, and IP subsystems
- Solution supports USB Type-C, SuperSpeed USB 3.1 at 10 Gbps, SuperSpeed USB 3.0 at 5 Gbps and High-Speed USB (USB 2.0) as well as DisplayPort 1.4 TX supporting RBR, HBR1, HBR2 and HBR3 bitrates
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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LPDDR5/4/4X PHY - TSMC 12FFC
- Supports JEDEC standard LPDDR5X, LPDDR5, LPDDR4 and LPDDR4X SDRAMs
- Support for data rates up to 6400 Mbps
- Designed for rapid integration with Synopsys’ LPDDR5/4/4X controller for a complete DDR interface solution
- DFI 5.0 controller interface
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DDR5/4 PHY - TSMC 12FFC
- Supports JEDEC standard DDR5 and DDR4 SDRAMs
- High-performance DDR PHY supporting data rates up to 8400 Mbps
- PHY independent, firmware-based training using an embedded calibration processor
- Supports up to 4 trained states/ frequencies with <3μs switching time
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25G PHY, TSMC 12FFC x8 North/South (vertical) poly orientation
- Supports 1.25 to 25.8 Gbps data-rate
- Supports PCI Express 4.0 with lane margining, 1G to 100G Ethernet, CCIX, and SATA protocols
- Supports x1 to x16 macro configurations with aggregation and bifurcation
- Spread Spectrum Clock (SSC), ` PCIe Separate Refclk Independent SSC (SRIS) and power management features
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25G PHY, TSMC 12FFC x4 North/South (vertical) poly orientation
- Supports 1.25 to 25.8 Gbps data-rate
- Supports PCI Express 4.0 with lane margining, 1G to 100G Ethernet, CCIX, and SATA protocols
- Supports x1 to x16 macro configurations with aggregation and bifurcation
- Spread Spectrum Clock (SSC), ` PCIe Separate Refclk Independent SSC (SRIS) and power management features