Die-to-Die IP
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UCIe PHY (Die-to-Die) IP
- Compliant with UCIe v2.0, supporting 4/8/12/16/24/32GT/s data rates
- for Standard Package up to 16 lanes / for Advanced Package up to 64 lanes
- Provides a 1024-bit data bus width with high-throughput die-to-die communication
- Includes automatic per-lane calibration and optional transmitter de-emphasis
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TSMC CLN5FF GUCIe LP Die-to-Die PHY
- IGAD2DY11A is an LP (Low Power) Die-to-Die (D2D) PHY for SoIC-X Face-to-Face advanced package.
- This GUCIe PHY not only supports UCIe specification rev 1.1 compliance physical layer and Raw D2D interface (RDI) but also optionally provides the
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Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N5 X24, North/South (vertical) poly orientation
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, AIB 2.0 PHY Ported to Intel 16, North/South (vertical) poly orientation
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N6 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X8, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
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Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC 12FFC X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
