2.5D GPU IP

Filter

Foundries

TSMC (6)

Nodes

3nm (3)
5nm (3)

IP Type

Silicon IP (9)

Compare 9 IP from 2 vendors (1 - 9)

2.5D GPU IP Core - API Support: Vivante VGLite API, OpenVG 1.1
- Embedded Linux support
- Pixel Rate (Pixel/Cycle): 1
- Display Resolution: up to 4K
- API Support: Vivante VGLite API, OpenVG 1.1
2.5D GPU IP Core - API Support: Vector Graphics, VGLite API
- Embedded Linux support
- Pixel Rate (Pixel/Cycle): 1
- Display Resolution: up to 4K
- API Support: Vector Graphics, VGLite API
Vector Graphics IP
- Display Resolution: Up to 4K
- ROPS (Pixels Per Cycle) : 1
- API Support:Vector Graphics VGLite API
- Embedded Linux Support
TSMC N3P Source Sync 3DIO PHY
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
TSMC N3P Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
TSMC N3P 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
TSMC N5 Source Sync 3DIO Library
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
Synopsys Synthesizable 3DIO IP for Flexible Physical Implementation
- Optimized for heterogeneous integration in 3D stacking
- Enabling designers the flexibility and scalability to accelerate multi-die integration
- Optimal PPA architected to supporting 2.5D and 3D packages
- Versatile offering tuned for optimal use scenarios, including:
3DIO PHY IP for TSMC N5
- Optimized for heterogeneous integration in 3D stacking
- TSMC N5