High-performance and low-power 3D graphics IP core for embedded devices.
It has high computing performance required for advanced visual computing and high-performance graphics performance required for virtual reality (VR) and augmented reality (AR) applications.
High-performance and low-power 3D graphics IP core
Overview
Key Features
- M3000 series are 3D GPU IP cores that support OpenGL® ES3.0 adopting the DMP 3D graphics architecture “Musashi” and achieve the industry’s highest-level PPA (Power / Performance / Area).
- With a configurable shader cluster architecture, the optimal GPU IP core configuration is provided according to customer’s requirements for performance and size.
Benefits
- API: OpenGL® ES 3.0 / 2.0
- Texture Format: OpenGL® ES supported format, ETC2, ASTC, YUV
- Maximum Resolution: 4k x 2k
- Memory BUS I/F: AXI 3 / 4
- Configuration Register I/F: AXI 3 / 4、APB
Video
DMP ant200 demo with Macnica Helio SoC Evaluation Kit
Applications
Technical Specifications
Maturity
Silicon Proven
Availability
Now
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