High-bandwidth, low-power and low-latency standardized die-to-die interconnect
The UCIe™ PHY is a high-bandwidth, low-power and low-latency die-to-die solution that enables multi-die system in package integration for high performance compute, AI/ML, 5G, automotive and networking applications. The UCIe™ physical layer includes the link initialization, training, power management states, lane mapping, lane reversal, and scrambling. The UCIe™ controller includes the die-to-die adapter layer and the protocol layer. The adapter layer ensures reliable transfer through link state management and parameter negotiation of the protocol and flit formats. The UCIe™ architecture supports multiple standard protocols such as PCIe, CXL and streaming raw mode.
