Vendor: Global UniChip Corp. (GUC) Category: Custom

TSMC CLN6FF/7FF Die-to-Die Interface PHY

This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps o…

TSMC 6nm N6FF Silicon Proven View all specifications

Overview

This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps operation. For IP detailed functional information, please refer to IP datasheet for IGAD2DX01A. This test chip adopts TSMC CLN6FF
? Process: TSMC 6 nm 0.75 V/1.8 V CMOS LOGIC FinFET Process or
TSMC 7 nm 0.75 V/1.8 V CMOS LOGIC FinFET Process
This test chip adopts TSMC 6 nm 0.75 V/1.8 V CMOS LOGIC FinFET Process
? Layer & Device: High R Resistance, ULVT
? Metal Scheme: 1P15M (1X_h_1Xa_v_1Ya_h_5Y_vhvhv_2Yy2Yx2R) or
1P13M (1X_h_1Xa_v_1Ya_h_5Y_vhvhv_2Yy2Z)
This test chip adopts 1P15M (1X_h_1Xa_v_1Ya_h_5Y_vhvhv_2Yy2Yx2R)

Key features

  • 32 full-duplex lanes per slice
  • 8 slices are included in analog hard macro
  • Lane repair
  • Data bus inversion
  • Parity check
  • Built-in test pattern and checker
  • EHOST : APB , I2C, and JTAG register interface
  • Built-in PLL
  • 0.25pJ/bit power consumption
  • 1.8V analog supply voltage for PLL and 0.75V analog/digital supply voltage
  • Independent power down mode for analog blocks
  • Operating junction temperature: -40°C ~ 125°C
  • Process : TSMC 6nm 0.75V/1.8V CMOS LOGIC FinFET Process or TSMC 7nm 0.75V/1.8V CMOS LOGIC FinFET Process
  • Metal Scheme : 1P15M (1X_h_1Xa_v_1Ya_h_5Y_vhvhv_2Yy2Yx2R) or 1P13M (1X_h_1Xa_v_1Ya_h_5Y_vhvhv_2Yy2Z)
  • Special layer and device type: High R Resistance, ULVT
  • Analog hard macro size: 690 um x 3037.44 um (2.096mm2) for horizontal macro and 3037.074 um x 690 um (2.096mm2) for vertical macro (pre-shrink)
  • Logic gate count: 1.5M
  • Supports both horizontal and vertical GDS orientation

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 6nm N6FF Silicon Proven

Specifications

Identity

Part Number
IGAD2DX01A
Vendor
Global UniChip Corp. (GUC)

Provider

Global UniChip Corp. (GUC)
HQ: Taiwan
Global Unichip Corp. (GUC), a dedicated full service SoC (System On Chip) Design Foundry based in Taiwan, was founded in 1998. GUC provides total solutions from silicon-proven IPs to complex time-to-market SoC turnkey services. GUC is committed to providing the most advanced and the best price-performance silicon solutions through close partnership with TSMC, GUC major shareholder, and other key packaging and testing power houses. With state of the art EDA tools, advanced methodologies, and experienced technical team, GUC ensures the highest quality and lowest risks to achieve first silicon success. GUC has established a global customer base throughout Greater China, Japan, Korea, North America, and Europe. Its track-record in complex SoC designs has brought benefits to customers in time to revenue at the lowest risk.

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Frequently asked questions about Custom Die-to-Die IP cores

What is TSMC CLN6FF/7FF Die-to-Die Interface PHY?

TSMC CLN6FF/7FF Die-to-Die Interface PHY is a Custom IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.

How should engineers evaluate this Custom?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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