Thermal Diode with Base Pin, TSMC N3E
Overview
Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. They are especially useful for monitoring changes in junction temperature or when junction temperature has stabilised. This In-Chip Sensing and PVT Monitoring IP is available as part of the Synopsys DesignWare® Foundation IP portfolio. It also forms the foundation of the new Synopsys Silicon Lifecycle Management (SLM) platform. SLM enables new levels of insight for both SoC providers as well as their customers to optimize operational activities at each stage of the device and system lifecycles from design to in-field.
Key Features
- Easily integrated
- Sense die temperature using external current source
- Created using standard digital process layers.
- Small size
Benefits
- Monitoring junction temperature on die
- Measuring absolute temperature
- Independent from rest of SoC
Applications
- Checking die temperature during production and reliability tests
- Checking die temperature before rebooting
- Thermal alarms
Deliverables
- GDSII
- LEF (Abstract) view
- Liberty timing files
- LVS netlist
- Verilog model
Technical Specifications
Foundry, Node
TSMC, N3E
Availability
Contact the Vendor
TSMC
Pre-Silicon:
3nm