The thermal diode macro is implemented using high current 1.2V-oxide bounded diodes. The thermal diode is a core situated macro, which may be used with on or off chip current sources and voltage measurements to determine die junction temperature.
For both signal integrity and ESD reasons, it is recommended that wide wires are used to connect the thermal diode to the IO pads (in the case of off-chip connectivity). The minimum wire width will depend on process options, and at a minimum must support ESD requirements of the chip and must be of sufficiently low resistance to support precise voltage measurements. A 3-current measurement is recommended to compensate for series resistance in the measurement path.
Functional Specification of Thermal Diode
