Specialty PECL IO IP, BOAC (Bonding Over Active Circuit), UMC 0.13um HS/FSG process
Overview
UMC 0.13um HS/FSG Logic process 3.3V PECL IO with POC (Pad On Circuit).
Technical Specifications
Foundry, Node
UMC 130nm HS/FSG
UMC
Pre-Silicon:
130nm
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