Certus is pleased to offer Reduced Gigabit Media Independent Interface (RGMII) compliant IOs in advanced technology nodes. The Certus solutions support system-selectable 1.8V & 2.5V supplies, output enable, hysteresis receiver, and full interoperability with the feature-rich Certus General-Purpose IO libraries.
Built into our IO libraries, and also offered as a separate service, is our strong ESD expertise. Certus was founded by ESD engineers and our results speak for themselves. Not only do we consistently exceed the standard ESD targets of 2KV HBM and 500V CDM, but we also provide on-chip solutions for standards such as IEC-61000-4-2, system-level ESD and Cable Discharge Events (CDE).
Certus also offers SD, I2C, SMBUS, DDC, LVDS, Analog/RF, HV and numerous other IO variants across most major foundries and technology nodes. We are particularly suited at providing customized options in a cost-efficient framework. Please contact us for supplementary physical or electrical features that can suit your needs.
RGMII I/O offerings
Overview
Key Features
- RGMII
- System-selectable 1.8V & 2.5V VDDIO support
- Output Enable
- Hysteresis receiver
- Full interoperability with Certus GPIO library
- Power sequence independence
- ESD protection of 2KV HBM, 500V CDM
- Physical Features
- Flexible cell and pad arrangements
- Wirebond and Flip-chip support
- Metal stack variants
Benefits
- System-selectable 1.8V & 2.5V VDDIO support
- Output enable
- Hysteresis receiver
- Interoperability with Certus GPIO libraries
- Flexible cell and pad arrangements
- Wirebond & Flip-chip support
- Metal stack variants
- Power sequence independence
- Proven HBM & CDM ESD protection
Block Diagram
Applications
- Reduced Gigabit Media Independent Interface (RGMII)
Deliverables
- GDS
- CDL netlist
- Verilog stub
- Verilog behavioral model
- LEF
- Liberty Timing Files
- IBIS (option)
- Electrical datasheet
- User guide and application notes
- Consulting and Support
Technical Specifications
Foundry, Node
TSMC 28nm, 22nm, 16nm, 12nm
Maturity
Silicon Proven
Availability
Immediate
TSMC
In Production:
12nm
,
16nm
,
22nm
,
28nm
HP
,
28nm
HPC
,
28nm
HPCP
,
28nm
HPM
Pre-Silicon: 12nm , 16nm , 22nm , 28nm HP , 28nm HPC , 28nm HPCP , 28nm HPM , 130nm G , 130nm LP
Silicon Proven: 12nm , 16nm , 22nm , 28nm HP , 28nm HPC , 28nm HPM
Pre-Silicon: 12nm , 16nm , 22nm , 28nm HP , 28nm HPC , 28nm HPCP , 28nm HPM , 130nm G , 130nm LP
Silicon Proven: 12nm , 16nm , 22nm , 28nm HP , 28nm HPC , 28nm HPM
Related IPs
- Open-drain I2C and SMBUS, DDC, CEC & HPD IO offerings
- IO & ESD solutions supporting GPIO, I2C,RGMII, SD, LVDS, HDMI & analog/RF across multiple technology nodes
- DDR2/DDR3/DDR3L/LPDDR/LPDDR2/LPDDR3 6 in one combo IO with auto calibration - 40nm LL
- GMII to RGMII
- GMII to RGMII convertor for SmartFusion2
- 28nm Wirebond IO library with dynamically switchable 1.8V/ 3.3V GPIO, 5V I2C open-drain, 1.8V & 3.3V analog, OTP program cell, and HDMI & LVDS protection macros - featured across a variety of metal stack and pad configuration options