RapidIO, Gen 2, 5G Baud, x1 and x4

The RapidIO® standard was adopted by a significant portion of the wireless industry as a high-speed interconnect and is typically used between digital signal processors and between the control plane processors and memory. RapidIO is also gaining acceptance as a backplane interconnect due to its adoption of widely used standards for the electrical characteristics of the physical media attachment (PMA) such as XAUI or CEI for up to 6.25 Gbaud data rate.