Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

Overview

Ceva-Waves Links is a versatile family of multi-protocol wireless platform IPs, encompassing the latest consumer wireless standards. It leverages the industry-leading Ceva-Waves Wi-Fi, Bluetooth, IEEE 802.15.4 (for Thread, Zigbee and Matter) and Ultra-Wideband (UWB) IPs to offer integration-friendly wireless solutions to accelerate the development of connectivity-rich SoCs for data transfer, security, localization and sensing applications. With its modular architecture, coupled with Ceva’s extensive experience in wireless systems, Ceva-Waves Links can deliver tailored solutions to address application-specific requirements. Each wireless protocol is supported through optimized hardware platforms for lowest power, accompanied by comprehensive software frameworks executing on the embedded processors, all designed for seamless integration with the RF.

The first member of the Ceva-Waves Links family, the Links100, is an integrated Wi-Fi 6 + Bluetooth 5.4 + 802.15.4 multi-protocol subsystem IP targeted for low power IoT applications.

Key Features

The Ceva-Waves Links100, is an integrated, low power, Wi-Fi + Bluetooth + 802.15.4 communications subsystem IP for IoT applications, with the following key features:
- Wi-Fi 6 1x1 40MHz optimized for cost-sensitive IoT applications ;
- Bluetooth 5.4 Dual Mode, supporting advanced Classic Audio and LE Audio with Auracast, and available with a comprehensive suite of Bluetooth profiles ;
- IEEE 802.15.4 (for Thread/Matter and ZigBee) for smart home and IoT applications ;
- Optimized co-existence scheme for efficient concurrent communications
- Pre-integrated with a low power multi-protocol 2.4GHz radio in TSMC 22nm process

Benefits

Turnkey integrated multi-protocol hardware and software platform
Faster TTF (Time to Fab) and TTM (Time to Market)
Integrated unified testbench
Optimized coexistence
Pre-adapted for TSMC 22nm ULL RF
Product specific customization available to fulfil project requirements

Block Diagram

Applications

IoT, smart home, industrial, smart watch

Deliverables

Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
Software: C code packages for each wireless protocol
Documents

Technical Specifications

Foundry, Node

TSMC 22nm ULL

Maturity

Ready for Production

Availability

Available

TSMC

Pre-Silicon: 40nm LP

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