Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)

Overview

The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.

Key Features

  • Highly versatile multi-protocol wireless connectivity solutions leveraging the latest and market proven Ceva-Waves integrated hardware IP and software platforms, including Wi-Fi, Bluetooth (Classic and LE), 802.15.4 (for Thread, Zigbee and Matter) and UWB
  • Optimized co-existence schemes for each specific configuration
  • Pre-integrated radio solutions, including RF from Ceva and various partners addressing a wide range of configurations and foundry process nodes
  • Easily adaptable to other RF implementations including customer’s own in-house developments
  • Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless-standard specifications
  • Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions

Benefits

  • Turnkey integrated multi-protocol hardware and software platform
  • Faster TTF (Time to Fab) and TTM (Time to Market)
  • Integrated unified testbench
  • Optimized coexistence
  • Pre-adapted for TSMC 22nm ULL RF
  • Product specific customization available to fulfil project requirements

Block Diagram

Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter) Block Diagram

Applications

  • IoT, smart home, industrial, smart watch

Deliverables

  • Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
  • Software: C code packages for each wireless protocol
  • Documents

Technical Specifications

Foundry, Node
TSMC 22nm ULL
Maturity
Ready for Production
Availability
Available
TSMC
Pre-Silicon: 40nm LP
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Semiconductor IP