ISO/IEC 7816-3 Analog Front End

Overview

Key Features

• five fully-integrated I/O pads: CLK, RST, I/O, VCC and GND
• fully compliant with the ISO/IEC 7816-3 standard (class A, B and C)
• proven track record through mass production in 130 nm CMOS process
• square pad with 80 µm x 80 µm opening
• operating junction temperature range: -40°C to 125°C
• CLK digital input pad: up to 50 MHz; internal pull-up; input noise rejection through optional filter and Schmitt trigger; standby mode; embedded level-shifters; power-up protection; silicon area smaller than 0.016 mm² in a 130 nm process
• RST digital input pad: internal pull-up; input noise rejection through Schmitt trigger buffer; standby mode; embedded level-shifters; power-up protection; silicon area smaller than 0.016 mm² in a 130 nm process
• I/O bidirectional digital pad: three output modes with optional slew-rate; internal pull-up; Schmitt triggers; standby mode; embedded level-shifters; power-up protection; independent control of Rx and Tx paths; silicon area smaller than 0.024 mm² in a 130 nm process
• VCC power supply pad: silicon area smaller than 0.010 mm² in a 130 nm process
• GND power supply pad: silicon area smaller than 0.010 mm² in a 130 nm process
• ESD protection (4 KV HBM) and digital controller available separately

Benefits

• ISO 7816-3 compliant
• Fully integrated
• Silicon proven
• Class A, B & C
• Internal pull-up

Deliverables

• GDSII stream and layer map file
• Library Exchange Format (LEF) file
• Circuit Description Language (CDL) netlist
• Liberty Timing File (.lib)
• VHDL behavioral model
• design specification

Technical Specifications