Overview
The I2C is a two-wire, bi-directional serial bus, which provides a simple and efficient method of short distance data transmission between many devices. The I2C MS core provides an interface between a microprocessor / microcontroller and I2C bus. It can work as a master or slave transmitter/receiver depending on a working mode determined by the microprocessor/microcontroller. The I2C MS core incorporates all features required by the latest I2C specification, including clock synchronization, arbitration, multi master systems and a high-speed transmission mode (the I2C MS supports all transmission speed modes). Built-in timer allows operation from wide range of clk frequencies. The I2C MS is technology independent, so either VHDL or VERILOG design can be implemented in variety of process technologies. Furthermore, it can be also completely customized in accordance to your needs. The I2C MS is delivered with fully automated test bench and complete set of tests, allowing easy package validation at each stage of SoC design flow.
Provider
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets.
T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules.
With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
Learn more about I2C / I3C IP core
The I2C (Inter-Integrated Circuit) Bus invented in 1980 by Philips Semiconductors (NXP Semiconductors today) was a massive step forward in simplifying communications in embedded systems. It is a simple two-wire interface for synchronous, multi-master/multi-slave, single ended serial communication. Fast forward 45 years to today and it is still widely used for attaching low speed peripheral Integrated Circuits (ICs), processors and microcontrollers. But silicon today has changed...
Early in my career selling chips for Motorola Semiconductor, the ability to spin derivative microcontroller chips for a customer’s specific requirement was relatively straightforward. If the volume looked reasonable, we would tape-out a new chip with a few added features because mask costs and wafers were relatively inexpensive at the larger process nodes. The customer won by getting an MCU tailored to their specific need, and Motorola won by gaining a more committed customer plus another SKU that could be sold to other customers – boosting ROI. With the migration to higher cost FinFET nodes, those times are long gone as the economics no longer work.
Sharmion Kerley, MIPI Director of Marketing and Membership
Imagine a camera subsystem that responds in microseconds, consumes less power, and offers a more straightforward route to time-to-market. For SoC architects and IP integration teams, that vision is increasingly possible with MIPI Camera Control Interface (CCI) over I3C.
