The HBM2E memory controller IP is designed for use in applications requiring high memory throughput including performance-intensive applications in AI, HPC and graphics.
The HBM2E Interface Subsystem
HBM2E is a high-performance memory that features reduced power consumption and a small form factor. It combines a 2.5D/3D architecture with a 1024-bit wide interface operating at a lower clock speed (as compared to GDDR6) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for AI/ML and HPC applications.
The HBM2E controller supports both HBM2 and HBM2E devices with data rates of up to 3.6 Gbps per data pin. It supports all standard channel densities including 4, 6, 8, 12, 16 and 24 Gb. The controller maximizes memory bandwidth and minimizes latency via Look-Ahead command processing. The core is DFI compatible (with extensions added for HBM2E) and supports AXI or native interface to user logic.
The HBM2E controller is fully compliant with the JEDEC HBM2E JESD235 standard. It supports data rates up to 3.6 Gbps per data pin. The interface features 8 independent channels, each containing 128 bits for a total data width of 1024 bits. The resulting bandwidth is 461 GB/s per HBM2E memory device containing 2, 4, 8 or 12 3D-stacked DRAM.
The HBM2E controller together with the customer’s choice of PHY comprise a complete HBM2E memory interface subsystem.
