The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package. MSquare's M2LINK D2D Solution, which is compatible with the UCIe v1.0 specification, includes both a Die-to-Die adapter layer and a physical layer. Each layer features a sideband interface that provides a back-channel for link training and register access of the link partner, as shown in Figure 1. This Unique hybrid analog/digital architecture offers low power consumption, compact footprint, and robust performance, making it highly suitable for applications in high-performance computing, AI, multimedia SoCs, and Die-to-Die interconnections.
