A 600MBps Low Power Die-to-Die Interface in TSMC 16nm FFC/FFC+.
This library is a production-quality, silicon-proven custom Die-to-Die high speed interface available in TSMC’s 16nm process. The I/O cell is bidirectional, has two modes of operation: standard full rail to rail swing, or a custom low noise pseudo-differential interface. The RX cells have a weak pull-down feature.
Operating Conditions
| Parameter | Value |
| Core Device | FFC (0.8V) |
| I/O Device | 1.8V |
| Core | Uses SVT only |
| BEOL | 2Xa1Xd_h (M5 below) |
| PAD | Flipchip |
| Cell Size | 50um x 50um |
| VDDCore | 0.8V |
| Tj | -40C to 125C |
Library Cell Summary
| Cell Name | Description |
| VX_HSIO | Bidirectional I/O Cell |
Pin List
| Pin | Type |
| VDD | Power |
| VSS | Ground |
| DIN | Input 0.8V |
| OE | Input 0.8V |
| DOUT | Output0.8V |
| IE | Input 0.8V |
| PE | Input 0.8V |
| BUMP | OUT0.8V |
