2D Graphics Processor for Wearables/IoT

Overview

Key Features

• HARWARE COMPONENTS
  • Programmable Shader engine with a VLIW instruction set
  • Command list based DMAs to minimize CPU overhead
  • Primitives Rasterizer
  • Texture Mapping Unit
  • Display Controller (optional)
• IMAGE TRANSFORMATION
  • Texture mapping
  • Point sampling
  • Bilinear filtering
  • Blit support
  • Rotation any angle
  • Mirroring
  • Stretch (independently on x and y axis)
  • Source and/or destination color keying
  • Format conversions on the fly
• BLENDING SUPPORT
  • Fully Programmable Alpha blending modes (source and destination)
  • Source/Destination color keying
• DRAWING PRIMITIVES
  • Pixel / Line drawing
  • Filled rectangles
  • Triangles (Gouraud Shaded)
  • Quadrilateral
• TEXT RENDERING SUPPORTS
  • Bitmap antialiased (A1 / A2 / A4 / A8 )
  • Font Kerning
  • Unicode (UTF8)
• COLOR FORMATS
  • 32-bit RGBA8888 / BGRA8888 / ABGR8888
  • 24-bit RGB
  • 16-bit RGBA5551 / RGB565
  • 8-bit ?8 / L8 / RGB332
  • 4-bit A4 / L4
  • 2-bit A2 / L2
  • 1-bit A1 / L1
  • TSCTM** (Optional) (Read Only)
  • YUV Read Only
  • ** Think Silicon Compression (proprietary)

Benefits

• Performance per mWatt per Dollar
• The NEMA®|GPU-Series performance per silicon area per clock frequency is unrivaled in its class. NEMA®|p has been designed to perform favorable against these critical performance benchmarks. As a result NEMA®|p uses 87% less active and 98% less idle power and has a 4 times smaller silicon footprint (compared to the competition), leading to significant cost reduction.
• Think Silicon's proprietary 4bpp (bits-per-pixel) real-time frame-buffer compression (TSCTMFB), the 6bpp texture compression and real-time de-compression (TSCTMT) benefits architects and finance controllers equally. The compressed images and the software libraries are so small in size that they fit into the internal SoC memory. As a result, expensive external DDR memory can be minimized or entirely eliminated. This reduces the SoC idle power consumption about impressive 98%, extends system battery life about 10 times and lowers the overall BOM cost. The combined performance and cost advantages make NEMA®|p to a Performance-Power-Cost leader in the class of 2D GPU's.

Block Diagram

Video

Nema|pico accelerating DirectFB - df_dok benchmark

Applications

• A fast 2D GUI interface and the NEMA®|pico XS is the perfect candidate to support entry level IoT-platforms, wearable and embedded devices with low cost and ultra-low power requirements supporting SoCs with a 32/64-bit MCU (e.g. ARM®| Cortex®| M processors) and provide fluid 2D graphics experience for a wide range of applications.
• Developers are able to create compelling 2D Graphical User Interfaces (GUIs) and software applications with ultra-long battery life at a significantly lower cost for power-memory-area constrained IoT devices.

Technical Specifications