12 bit digital output CMOS temperature sensor in 28nm

Overview

TSENU28HPCP is an IP for temperature sensing of the silicon chip die. Each voltage sensor node is connected with the central controller with a single wire digital signal for communicating the sensor data in real time. Dedicated enable signal is provided with each node to enable or disable the operation for power management. IP has parallel communication interface with command and response protocol using two 12bit digital I/O ports. Alert signals can also be configured to alert low and high threshold crossing using parallel communication port.
Sensor has trimming options to calibrate the accuracy of temperature probes.
Design is based on ultra-low power delta sigma modulator with excellent noise performance and high accuracy eliminating all inherent offset and gain errors while implementing the compensation inbuilt in the loop

Key Features

• 14b Digital Temperature Resolution
• 1Ksps Maximum data rate
• <100uA Current Consumption
• Ultra-low leakage power
• Ultra-low active power
• Excellent temperature accuracy
o +/- 1.5C after single room temperature trim
• Compact Area
• -40C to +125C Temperature Range
• UMC28nm HPC+

Benefits

One degree accurate
Thermal sensor

Applications

• Die Temperature monitoring
• Under and over temperature monitoring
• System performance enhancement

Deliverables

Datasheet
Hard Macro (GDSII)
Characterization Report (as applicable)
Abstract View (LEF)
Integration and Customer

Technical Specifications

Foundry, Node

28nm

Maturity

Silicon validated

Availability

May 2020

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