Vendor: T2M GmbH Category: Multi-Protocol PHY

12.5G Multiprotocol Serdes IP, Silicon Proven in TSMC 28HPC+

The multi-protocol SerDes PHY consists of Serial ATA (SATA) conforming with SATA 3.0 Specification, Peripheral Component Intercon…

TSMC 28nm HPC+ In Production View all specifications

Overview

The multi-protocol SerDes PHY consists of Serial ATA (SATA) conforming with SATA 3.0 Specification, Peripheral Component Interconnect Express (PCIe) compliant with PCIe 2.0 Base Specification with support for PIPE interface spec, Universal Serial Bus (USB) compliant with USB 3.0, USB 2.0 (USB Highspeed and Full speed), and USB 3.0 compliant with USB 3.0. Support for extra PLL control, reference clock control, and inbuilt power gating control results in lower power usage. Additionally, the PHY is broadly usable for diverse circumstances under varying considerations of power consumption because the aforementioned low power mode option is customizable.

Key features

  • A universal SERDES IP that operation from 1Gbps to 12.5 Gbps
  • Compatible with PCIe/USB3/SATA base Specification
  • Support 40-bit/32-bit/20-bit/16-bit parallel interface
  • Support for PCIe2(5.0Gbps), USB3.0(5.0Gbps) and SATA3(6.0Gbps)
  • Backward compatible with 2.5Gbps for PCIe
  • Backward compatible with 1.5Gbps, 3.0Gbps for SATA
  • Support flexible reference clock frequency
  • Support 100MHz differential reference clock input or output (with SSC optionally) in PCIe Mode
  • Support Spread-Spectrum clock (SSC) generation and receiving from -5000ppm to 0ppm
  • Support programmable transmit amplitude and Deemphasis
  • Support TX detect RX function in PCIe and USB3.0 Mode
  • Support Beacon signal generation and detection in PCIe Mode
  • Support LFPS signal generation and detection in USB Mode
  • Support Low Frequency Periodic Signalling (LFPS) generation and detection in USB3.0 Mode
  • Production test support is optimized through high coverage at-speed BIST and loopback
  • Integrated on-die termination resistors and IO Pads/Bumps
  • Embedded Primary & Secondary ESD Protection
  • ESD: HBM/MM/CDM/Latch Up 2000V/200V/500V/100mA
  • Silicon Proven in TSMC 28nm HPC+

Applications

  • PC
  • Television
  • Data storage
  • Multimedia Devices
  • Recorders
  • Mobile devices

What’s Included?

  • Application Note / User Manual
  • Behavior model, and protected RTL codes
  • Protected Post layout netlist and Standard
  • Delay Format (SDF)
  • Synopsys library (LIB)
  • Frame view (LEF)
  • Metal GDS (GDSII)
  • Test patterns and Test Documentation

Files

Note: some files may require an NDA depending on provider policy.

Silicon Options

Foundry Node Process Maturity
TSMC 28nm HPC+ In Production

Specifications

Identity

Part Number
12.5G Multiprotocol Serdes IP in 28HPCP
Vendor
T2M GmbH

Provider

T2M GmbH
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets. T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules. With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.

Learn more about Multi-Protocol PHY IP core

How a 16Gbps Multi-link, Multi-protocol SerDes PHY Can Transform Datacenter Connectivity

Increasingly, more of the focus on mobile has centered around cloud datacenters and the networking to get the data back and forth between these datacenters and the mobile device. Functions like voice recognition and mapping depend on the ability to split the functionality between the smartphone, for local processing like encryption and compression, and the back end, where a large number of servers can do the heavier lifting before returning the results.

One PHY, Zero Tradeoffs: Multi-Protocol PHY for Edge AI Interface Consolidation

The Cadence 10G multi-protocol PHY was architected to address this exact challenge. Designed to scale across multiple process nodes, it consolidates PCI Express (PCIe), USB, DisplayPort, Ethernet, and other interfaces into a single, compact, silicon-efficient block. What sets it apart is simultaneous multi-protocol support, which enables multiple data paths without duplicating hardware, requiring extra board connectors, or paying the area and power penalty of separate IP blocks.

Frequently asked questions about Multi-Protocol PHY IP cores

What is 12.5G Multiprotocol Serdes IP, Silicon Proven in TSMC 28HPC+?

12.5G Multiprotocol Serdes IP, Silicon Proven in TSMC 28HPC+ is a Multi-Protocol PHY IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

×
Semiconductor IP