Memory Interfaces IP for TSMC
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Memory Interfaces IP
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M31 eMMC/SDIO at TSMC 22ULP Process
- Supports HS400 (400Mbps), HS200 (200Mbps), High-speed DDR (52Mbps) and etc.
- Consisting of driver, receiver & pull-up/down resistors
- Power-sequence free
- Provides multi-driving-strength selection
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M31 eMMC/SDIO at TSMC 22ULL Process
- Supports HS400 (400Mbps), HS200 (200Mbps), High-speed DDR (52Mbps) and etc.
- Consisting of driver, receiver & pull-up/down resistors
- Power-sequence free
- Provides multi-driving-strength selection
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Memory Compiler in TSMC (16nm,22nm,28nm,40nm,55nm,90BCD+,110nm,152nm,180BCD)
- Synchronous read/write operation
- Low leakage current and lower operation power consumption
- Minimum metal layer requirement: 4/3 metal layers
- High density layout structure and small area design
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ONFI_4 IO Pad Set
- ONFI Single-Ended Driver / Receiver Features:
- ? Driver – user-selectable on-die termination and programmable drive strength with ODT / ZO calibration and programmable “off” state control.
- o ODT Rtt = 30? / 50? / 75? / 100? / 150?
- o ZOUT = 18? / 25? / 35? / 50?
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7 way DDR combo
- Full DDR4 capability
- Full DDR3 / DDR3L / DDR3U capability
- Full LPDDR4 capability
- Full LPDDR3 capability
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I2C I/O Pad Set
- • Supported I2C operating modes:
- o Standard-mode (Sm) – 100 Kbps data rate
- o Fast mode (Fm) – 400 Kbps data rate
- o Fast mode (Fm+) – 3.4 Mbps data rate
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ONFI 4.1 I/O Pad Set
- ONFI Single-Ended Driver / Receiver Features:
- ? Driver – user-selectable on-die termination and programmable drive strength with ODT / ZO calibration and programmable “off” state control.
- o ODT Rtt = 30? / 50? / 75? / 100? / 150?
- o ZOUT = 18? / 25? / 35? / 50?
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7 way DDR combo
- Full DDR4 capability
- Full DDR3 / DDR3L / DDR3U capability
- Full LPDDR4 capability
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RF I/O Pad Set and Discrete RF ESD Protection Components
- Includes
- Analog / RF cells
- o Low voltage LNA input pad (1.5V)
- o High voltage LNA input pad (3.3V)
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SSTL with bi-directional I/O’s, Vref, and ODT for DDR2 memory (1.8 V)
- • Mode select – DDR2 or DDR3
- • Single-ended and differential signaling
- • DDR2 capability
- o Compliant with JEDEC specification JESD79-2E, DDR2-400