MCU PAD - SMIC 55nm Eflash

Key Features

• 5V/1.8V/3.3V/1.2V power supply can be used, not only compatible with normal 1.8V/3.3V
• powering system, and also 5V or lithium battery powering system
• ? Including ultra-low leakage MCU I/O total solution
• ? Supports 1.2V core voltage power off, and get ultra-low leakage
• ? Provides a wide variety of interrupt I/O for customers to easily communicate with outside
• world at low power states
• ? The powerful level shift structure can help customers use fixed internal I/O voltage, but
• unfixed power voltage for the outside interface
• ? All I/O support that the voltage of PAD is higher than I/O power??
• ? Built in power-on-control function to prevent chip latch-up potential risk during chip powering up
• Standard I/O size is low to 70um*128um
• HBM ESD: >2000V; MM: ±200V; CDM: ±500V; LU: 150mA

Benefits

• Cost saving compared to eflash technology

Deliverables

• Technical documents,GDS hard macro to foundry for IP merge

Technical Specifications